ATS-59002-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1367-ND

Manufacturer Part#:

ATS-59002-C1-R0

Price: $ 18.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 25MM X 32MM X 13MM
More Detail: Heat Sink Flip Chip Processors Aluminum Top Mount
DataSheet: ATS-59002-C1-R0 datasheetATS-59002-C1-R0 Datasheet/PDF
Quantity: 87
1 +: $ 16.83360
10 +: $ 15.90120
25 +: $ 14.96580
50 +: $ 14.03050
100 +: $ 13.09500
250 +: $ 12.15970
500 +: $ 11.92580
Stock 87Can Ship Immediately
$ 18.52
Specifications
Series: maxiGRIP
Part Status: Active
Type: Top Mount
Package Cooled: Flip Chip Processors
Attachment Method: Clip
Shape: Rectangular, Angled Fins
Length: 0.984" (25.00mm)
Width: 1.260" (32.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.512" (13.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat Sinks

Heat Sinks are a type of thermal management system used to keep temperatures at acceptable levels and prevent damage to sensitive components. Heat Sinks work by transferring heat away from components and releasing it into the surrounding environment. The ATS-59002-C1-R0 is a popular and widely used Heat Sink system due to its versatility and efficiency.

ATS-59002-C1-R0 Application Field & Working Principle

The ATS-59002-C1-R0 is a single-stage Heat Sink designed for applications up to 90 Watts. The Heat Sink includes a 120 x 120mm aluminum fin with an optimized fin design for high-airflow systems. The Heat Sink also utilizes a cross-flow air pattern, which cuts down on air resistance and maximizes heat dissipation. The base plate is made of aluminum and features a medium-thickness design which allows for effective heat conduction from the bottom of the Heat Sink to the top.

The working principle of the ATS-59002-C1-R0 is based on the basic heat transfer equation. Heat is generated by the components of the electronic device, such as a voltage regulator or processor, and then dissipated into the ambient environment. The Heat Sink acts as a middleman between the components and the environment to help efficiently transfer the heat away from the components. Heat is conducted through the fins of the Heat Sink and then dissipated through radiation and convection. The fins act like a radiator, which attracts air to the Heat Sink as it is warmed. This air helps to cool the fins, which in turn, cools the components.

The Heat Sink has been developed in several sizes, with different wattage thresholds ranging from 35-90W. This feature allows the use of the Heat Sink for applications ranging from power supplies, lightning systems, and heavy-duty computers to automation systems and LCD monitors. The ATS-59002-C1-R0 can also be used in some commercial applications such as industrial ovens and power transformers.

Advantages and Applications

The ATS-59002-C1-R0 has several advantages, including a low profile design which allows for easy installation, excellent thermal performance, and minimal noise. The Heat Sink also has a wide range of applications, including but not limited to computers, telecommunications, automotive, server/data centers, power supplies, consumer electronics, military/aerospace, or any application that requires efficient heat dissipation.

Conclusion

The ATS-59002-C1-R0 is an effective and versatile Heat Sink system that is capable of dissipating heat quickly and quietly. The Heat Sink has a low profile design which allows for easy installation and offers an optimized fin design for improved air flow. The Heat Sink can be used in a wide variety of applications and is suitable for devices with power requirements up to 90 watts. As other Heat Sinks and fans become outdated, the ATS-59002-C1-R0 is sure to remain a top choice for thermal management systems.

The specific data is subject to PDF, and the above content is for reference

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