| Allicdata Part #: | ATS1368-ND |
| Manufacturer Part#: |
ATS-59003-C1-R0 |
| Price: | $ 12.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32MM X 50MM X 12MM |
| More Detail: | Heat Sink Flip Chip Processors Aluminum Top Mount |
| DataSheet: |  ATS-59003-C1-R0 Datasheet/PDF |
| Quantity: | 61 |
| 1 +: | $ 11.25810 |
| 10 +: | $ 10.63310 |
| 25 +: | $ 10.00770 |
| 50 +: | $ 9.38224 |
| 100 +: | $ 8.75672 |
| 250 +: | $ 8.13127 |
| 500 +: | $ 7.97489 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Flip Chip Processors |
| Attachment Method: | Clip |
| Shape: | Rectangular, Angled Fins |
| Length: | 1.260" (32.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management of various electronic components is becoming increasingly important in modern industry. Heat sinks are used to regulate and dissipate the heat generated by high-power components. The ATS-59003-C1-R0 is a heat sink that is designed for this purpose.
This particular type of heat sink is particularly well suited to the thermal regulation of ultra-compact, sensitive electronic components. It is designed to be extremely lightweight and highly efficient at heat dissipation. It features a unique design that is composed of a base that is a full aluminum extrusion, along with a clipped fin heat-sink profile. The base has excellent thermal conductivity which helps to ensure the highest efficiency for dissipation and regulation.
In terms of its actual use, this type of heat sink works by dissipating and regulating excess energy generated by the sensitive electronic components. Its fanless and compact design enables it to sit close to the component itself, allowing heat from the component to be efficiently drawn away to the base of the heat sink. This newly created heat is then dissipated to the environment by the extruded aluminum of the base.
The ATS-59003-C1-R0 also incorporates other features that help to ensure its efficient performance. Its high-efficiency design helps to reduce the temperature of the component, even in the most demanding applications. Additionally, the base features a modular design which makes it compatible with a wide range of components and is also designed to provide easy installation.
The ATS-59003-C1-R0 has numerous applications in both industrial and commercial settings. It can be used in a variety of electronic devices which require effective thermal regulation for their components. This includes computers, servers, and other types of electronic equipment. It is particularly suitable for ultra-compact systems which can benefit from its highly efficient design.
The ATS-59003-C1-R0 proves to be a very useful and efficient heat sink for managing high-power components in a wide variety of applications. Its lightweight and energy-efficient design makes it an ideal choice for thermal regulation of sensitive electronic components. Its advanced design and features make it highly efficient at heat dissipation and regulation, while its compact size and easy installation make it an ideal choice for any application.
The specific data is subject to PDF, and the above content is for reference