| Allicdata Part #: | ATS1416-ND |
| Manufacturer Part#: |
ATS-61270D-C1-R0 |
| Price: | $ 7.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 27X27X9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61270D-C1-R0 Datasheet/PDF |
| Quantity: | 270 |
| 1 +: | $ 6.99300 |
| 10 +: | $ 6.65847 |
| 25 +: | $ 6.24204 |
| 50 +: | $ 6.03401 |
| 100 +: | $ 5.53468 |
| 250 +: | $ 5.20176 |
| 500 +: | $ 5.09772 |
| 1000 +: | $ 5.07691 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-61270D-C1-R0 is a thermal - heat sink, ideal for cooling various electronics-based applications such as laser systems, consumer electronics, computers and servers. The thermal - heat sink is designed with a copper base and aluminum fins, which efficiently transfers the heat generated by the electronics to the outside environment. The copper base is connected to the electronic components inside the device and acts as a heat spreader. The aluminum fins allow for better heat dissipation. The heat dissipatiation is further improved with a special fan that is mounted on the thermal - heat sink.
The working principle of the ATS-61270D-C1-R0 is quite simple. Heat is absorbed from the electronic components and is transferred to the copper base through conduction. The copper base then transfers the heat to the aluminum fins. The fins help dissipate the heat into the surrounding environment with the help of the fan. The fan helps generate an air flow around the fins, which increases the heat dissipation. The fins also help reduce the temperature of the circuits inside the device.
The ATS-61270D-C1-R0 is highly suitable for cooling various electronics-based applications such as laser systems, consumer electronics, computers and servers. The thermal - heat sink helps maintain the optimal temperature of the electronics and prevents them from getting overheated. The thermal - heat sink is also lightweight and durable, making it a ideal solution for cooling applications.
The ATS-61270D-C1-R0 is easy to mount and requires minimal maintenance. It is available in different sizes and can be customized according to the requirements of the application. The thermal - heat sink is also cost effective and available at an affordable price.
The ATS-61270D-C1-R0 is one of the most advanced thermal - heat sinks available in the market today. It offers highly efficient heat transfer and can be used for cooling various electronics-based applications such as laser systems, consumer electronics, computers and servers. The thermal - heat sink is lightweight, durable and easy to mount, making it an ideal choice for cooling applications.
The specific data is subject to PDF, and the above content is for reference