| Allicdata Part #: | ATS1427-ND |
| Manufacturer Part#: |
ATS-61270K-C1-R0 |
| Price: | $ 8.18 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 27X27X14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61270K-C1-R0 Datasheet/PDF |
| Quantity: | 97 |
| 1 +: | $ 7.44030 |
| 10 +: | $ 7.08561 |
| 25 +: | $ 6.64297 |
| 50 +: | $ 6.42159 |
| 100 +: | $ 5.89012 |
| 250 +: | $ 5.53581 |
| 500 +: | $ 5.42509 |
| 1000 +: | $ 5.40295 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-61270K-C1-R0 is a type of heat sink found in thermal management applications. A heat sink is a passive device used to transfer thermal energy from one part of an electrical system to another. Heat sinks are typically used in electronic components, such as CPUs and GPUs, to improve their efficiency. The ATS-61270K-C1-R0 is a commercial-grade, low-profile heat sink made from high-tensile aluminum alloy and offering superior thermal performance.
In a general sense, the purpose of a heat sink is to dissipate heat generated by the components they are connected to. The ATS-61270K-C1-R0 can easily perform this task due to its efficient design, which features a variety of thermally conductive features. It consists of a solid base, two evenly spaced mounting brackets, multiple fins, and numerous embossed channels that enhance its heat-dissipating properties.
One of the most important parts of a heat sink is its fins. The fins on the ATS-61270K-C1-R0 are precision-cut, wide-stance, aluminum fins. These create a large surface area in which heat can dissipate quickly and evenly. Additionally, they ensure a relatively low air resistance. This, in turn, increases the overall rate of heat dissipation.
The channels on the ATS-61270K-C1-R0 are also beneficial for heat dissipation. These channels are strategically placed between the base and the fins. As air passes through these channels, the heat is absorbed by the surrounding material and is progressively pushed away from the component. This facilitates an efficient exchange of thermal energy.
Because heat sinks are passive components, they are typically used in applications with low power densities. This is why the ATS-61270K-C1-R0 is mostly used in computer systems and other devices that require cooling without the need for a large number of fans or other active cooling solutions. It is an ideal choice for applications that require a low profile and reliable performance.
In terms of performance, the ATS-61270K-C1-R0 offers excellent results. It boasts an impressive thermal resistance rating of 1.9°C/W, which is significantly lower than many comparable solutions. As a result, it is capable of effectively reducing the temperature of connected components by a considerable amount.
In conclusion, the ATS-61270K-C1-R0 is a reliable and efficient heat sink that is well-suited for applications where a low profile and superior thermal performance are required. Its wide-stance fins and strategically placed channels ensure enhanced heat dissipation capabilities, making it a great choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference