ATS-61270W-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1449-ND

Manufacturer Part#:

ATS-61270W-C1-R0

Price: $ 9.02
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: MAXIGRIP FANSINK 27X27X24.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-61270W-C1-R0 datasheetATS-61270W-C1-R0 Datasheet/PDF
Quantity: 66
1 +: $ 8.19630
10 +: $ 7.80885
25 +: $ 7.32060
50 +: $ 7.07665
100 +: $ 6.49095
250 +: $ 6.10051
500 +: $ 5.97851
1000 +: $ 5.95411
Stock 66Can Ship Immediately
$ 9.02
Specifications
Series: fanSINK, maxiGRIP
Part Status: Discontinued at Digi-Key
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Pin Fins
Length: 1.063" (27.00mm)
Width: 1.063" (27.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.965" (24.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks have a particular purpose in maintaining a safe operating temperature on electronic components. ATS-61270W-C1-R0 is a thermal heat sink specifically designed to protect against overheating of heat-sensitive components.This thermal heat sink is used for applications such as in power supplies, telecom systems, medical imaging devices, and industrial systems. It is built with thermoplastic composite material and is designed for optimal heat dissipation, thermal insulation, and low-noise operation. The ATS-61270W-C1-R0 thermal heat sink boasts an impressive thermal dissipation capacity. It features a thermal performance rating of 2 W/m-K, an 18 K/W rating, and nearly silent operation – the thermal noise emission is rated at 16dB in a 10 cm2 air cavity. The thermal heat sink is designed to balance efficiency with safety. It features a unique bonding technique that achieves minimal thermal resistance between the component and heat sink, while the low profile provides improved mechanical touch sensitivity.The ATS-61270W-C1-R0 thermal heat sink also features a modular construction, which provides simple assembly, quick installation, and easy access to the component. It has a footprint of only 1.85 in2 and can be mounted horizontally or vertically.In terms of its working principle, the ATS-61270W-C1-R0 works by dissipating heat away from the heat-sensitive components. The thermoplastic composite material works to effectively move the heat away from these components, while the unique bonding technique helps create a minimal thermal resistance between the component and heat sink. This combination ensures adequate levels of cooling and thermal management. When the thermal heat sink is in operation, it will prevent the components from overheating. This can help prolong the life of the components and improve their reliability. Overall, the ATS-61270W-C1-R0 thermal heat sink is an ideal choice for applications that require thermal management and cooling without compromising on performance or safety. Its efficient design and larger surface area ensures it dissipates heat quickly and efficiently, while its modular construction makes it easy to install and use.

The specific data is subject to PDF, and the above content is for reference

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