| Allicdata Part #: | ATS2588-ND |
| Manufacturer Part#: |
ATS-61270W-C2-R0 |
| Price: | $ 9.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 27X27X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61270W-C2-R0 Datasheet/PDF |
| Quantity: | 197 |
| 1 +: | $ 8.27820 |
| 10 +: | $ 7.88571 |
| 25 +: | $ 7.39319 |
| 50 +: | $ 7.14672 |
| 100 +: | $ 6.55521 |
| 250 +: | $ 6.16092 |
| 500 +: | $ 6.03770 |
| 1000 +: | $ 6.01306 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important technique for maintaining a product\'s operating environment. Heat sinks are typically used to keep the heat generated by components and other equipment away from the components themselves, providing efficient cooling capabilities. ATS-61270W-C2-R0 is a high-performance, slim heat sink designed for high power applications with limited clearance, and can offer excellent performance in variety of applications.
atics-61270W-C2-R0 is a type of passive thermal management system that uses the conduction of heat through solid objects. It is engineered for efficient heat transfer and as a result, it is well-suited for high power dissipation and temperature control. Its slim design and low profile allow it to be used in applications with limited clearance. Its aluminum fin structure facilitates efficient heat dissipation, while its aluminum base ensures it is lightweight and durable.
The ATS-61270W-C2-R0\'s application field is extensive. It can be used in a variety of electronic products and equipment in need of effective temperature control. It can be used to cool CPUs, graphics chips, miniature fanless systems, and other electronic components. It is also ideal for 1U and 2U servers, routers, and other equipment that require fans for cooling. Its slim design also makes it well-suited for use on small computing boards.
The working principle of the ATS-61270W-C2-R0 is simple yet effective. It relies on conduction to transfer heat away from the integrated components or systems. Heat is conducted from the components or systems to the heat sink via its aluminum base. The aluminum fins on the heat sink then dissipate the heat to the surrounding environment. This allows heat to be dissipated much faster than a typical heatsink, resulting in improved heat dissipation and temperature control performance.
The ATS-61270W-C2-R0 is a great choice for any application in need of reliable thermal management and heat dissipation performance. Its slim and lightweight construction provides efficient cooling capabilities without sacrificing space or increasing product weight. Its aluminum fin structure also allows for efficient heat dissipation, providing excellent temperature control even at high power applications.
In summary, the ATS-61270W-C2-R0 is a high-performance, slim heat sink ideal for applications requiring reliable thermal management. Its aluminum fin structure allows for excellent heat dissipation and temperature control performance. It is well-suited for cooling CPUs, graphics chips, fanless systems, and other electronic components. It is also an ideal choice for routers, servers, and other high power applications with limited space.
The specific data is subject to PDF, and the above content is for reference