ATS-61290K-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1428-ND

Manufacturer Part#:

ATS-61290K-C1-R0

Price: $ 8.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: MAXIGRIP FANSINK 29X29X14.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-61290K-C1-R0 datasheetATS-61290K-C1-R0 Datasheet/PDF
Quantity: 51
1 +: $ 7.49070
10 +: $ 7.13664
25 +: $ 6.69060
50 +: $ 6.46771
100 +: $ 5.93239
250 +: $ 5.57558
500 +: $ 5.46407
1000 +: $ 5.44176
Stock 51Can Ship Immediately
$ 8.24
Specifications
Series: fanSINK, maxiGRIP
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Pin Fins
Length: 1.142" (29.00mm)
Width: 1.142" (29.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.571" (14.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

The ATS-61290K-C1-R0 is a type of thermal solution product-specifically, a type of thermal-heat sink that is used mainly in electronic applications. As the natural conduction of heat is often insufficient to quickly and efficiently meet the energy requirements of electronic systems, thermal design solutions are necessary for effective heat transfer and dissipation. Heat sinks act as safe and efficient heat transfer conductors in order to keep processors and other sensitive electronic components from becoming too hot and preserving the life of the electronics.In the past, thermal solutions were mostly only used in cooling high performance CPUs or power modules. However, as computing power and complexity continue to rise, these types of solutions are becoming more common in a variety of applications.

Applications

The ATS-61290K-C1-R0 thermal-heat sink is generally used in the following applications:– Servers and network switches, including high-end gaming servers and graphics processors– Medical electronics, including ultrasound imaging systems and MRI equipment– Automotive electronics, including engine control systems, infotainment systems, and ABS brakes– Telecommunications, including cellular base station power amplifiers– Industrial electronics, including sensors, robots, and industrial process control systemsThe ATS-61290K-C1-R0 is a robust and reliable thermal solution that guarantees effective heat dissipation and longevity for all of these applications.

Features & Benefits

The ATS-61290K-C1-R0 thermal-heat sink has several key features and benefits that make it ideal for a variety of applications. These include:– High performance: The ATS-61290K-C1-R0 is designed for maximum heat removal capabilities and can be easily adapted to the specific needs of different applications.– Long service life: The ATS-61290K-C1-R0 is extremely durable, ensuring long-term performance and reliability. – Easy installation: The ATS-61290K-C1-R0 has a simple installation process, allowing for fast, easy, and reliable installation. – Cost-effective: The ATS-61290K-C1-R0 is a cost-effective solution that offers full compatibility with all standard and specialized electronic components.

Working Principle

The ATS-61290K-C1-R0 uses a combination of the principles of natural convection and conduction to efficiently and effectively transfer heat away from sensitive electronic components and into a cooling environment. Natural convection is a type of fluid flow that results from the differences in density of the fluid due to the heating of the surface below. The heat transfer process is caused by the movement of the heat from a warm region to a cooler one, and it is then dissipated into the atmosphere through the thermal-heat sink. The conduction component of the ATS-61290K-C1-R0 is a process of direct heat transfer between two solid objects, in this case a heat generating electronic component and the ATS-61290K-C1-R0 thermal-heat sink. The conductor (the heat sink) must be thermally and electrically conductive to ensure maximum efficiency in the transfer of heat and optimal preservation of the electronic component’s operational life. The combination of both convection and conduction within the ATS-61290K-C1-R0 thermal-heat sink ensures a rapid and effective transfer of heat away from the electronic component, preventing excessive heat build-up and limiting the possibility of system failure.

Conclusion

The ATS-61290K-C1-R0 thermal-heat sink is an effective and reliable solution for a variety of electronic applications, including servers, medical electronics, automotive electronics, telecommunications, and industrial electronics. Its combination of natural convection and conduction ensures maximum heat dissipation, while its size and ease of installation make it ideal for a variety of applications. As electronic systems continue to become more complex, thermal solutions such as the ATS-61290K-C1-R0 will become increasingly important for the reliable and efficient operation of electronic components.

The specific data is subject to PDF, and the above content is for reference

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