| Allicdata Part #: | ATS1439-ND |
| Manufacturer Part#: |
ATS-61290R-C1-R0 |
| Price: | $ 8.55 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 29X29X19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61290R-C1-R0 Datasheet/PDF |
| Quantity: | 90 |
| 1 +: | $ 7.77420 |
| 10 +: | $ 7.40124 |
| 25 +: | $ 6.93882 |
| 50 +: | $ 6.70761 |
| 100 +: | $ 6.15245 |
| 250 +: | $ 5.78236 |
| 500 +: | $ 5.66672 |
| 1000 +: | $ 5.64360 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is an important function for many electronic components, often seen in the form of a Heat Sink. Heat Sinks are designed to draw excessive heat away from components, thus helping them run more efficiently and reducing the risk of overheating. The ATS-61290R-C1-R0 is a popular choice in heat sink solutions. Let us examine how this model works, and some of its applications.
Heat Sink Design and Construction
The ATS-61290R-C1-R0 Heat Sink looks like a tall, narrow extruded aluminum casing with a series of curved fins at the top. When placed on an electronic device, the fins of the Heat Sink draw heat away from the electronic components. The heat is then transferred through the aluminum casing to a cooling system of some kind (usually air). The ATS-61290R-C1-R0 has a heat conductivity rating of 1.8 W/m.k, which means it is able to transfer heat from the component to the cooling system very efficiently.
Heat Sink Performance and Applications
The performance of the ATS-61290R-C1-R0 Heat Sink depends on several factors. The cooling system it is used with can affect its performance, as can the type of electronic component it is being used on. For this reason, it is important to select the right heat sink for the application.
The ATS-61290R-C1-R0 heat sink is most often used with devices like microprocessors, ASICs, FPGAs, and other integrated circuit or electrical components. It is designed for low to medium heat dissipation applications, and is particularly suitable for cooling chips that generate low to medium levels of heat. It is also well suited for use in low-pressure systems, since it does not require large amounts of pressure to function.
Installation and Maintenance
Installing and maintaining the ATS-61290R-C1-R0 Heat Sink is relatively easy. To install, simply screw the heat sink onto the electronic component using the four included mounting screws. It is important to ensure the component and heat sink are securely fastened together. Additionally, the device should be mounted securely onto a rigid, flat surface to ensure adequate cooling and proper use of the device.
In order to ensure optimal performance, periodic maintenance is required. Clean the heat sink regularly with air or a soft brush to clear away any dust or debris that might have accumulated. Cleaning at least every two months is recommended. Additionally, the fan or other cooling system used with the Heat Sink should be kept clean and dust-free at all times in order to ensure proper functioning.
Conclusion
The ATS-61290R-C1-R0 is a popular heat sink solution designed for use with low to medium power electrical and integrated circuit components. Its design ensures efficient heat transfer and its lightweight and compact size make it an ideal solution for many applications. Proper installation and regular maintenance will ensure the device continues to perform at its best.
The specific data is subject to PDF, and the above content is for reference