| Allicdata Part #: | ATS1450-ND |
| Manufacturer Part#: |
ATS-61290W-C1-R0 |
| Price: | $ 9.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 29X29X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61290W-C1-R0 Datasheet/PDF |
| Quantity: | 87 |
| 1 +: | $ 8.26560 |
| 10 +: | $ 7.86996 |
| 25 +: | $ 7.37779 |
| 50 +: | $ 7.13195 |
| 100 +: | $ 6.54173 |
| 250 +: | $ 6.14825 |
| 500 +: | $ 6.02528 |
| 1000 +: | $ 6.00069 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Discontinued at Digi-Key |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-61290W-C1-R0 thermal heat sink is a versatile and efficient cooling element for a wide range of applications. It offers an extremely high heat transfer coefficient, allowing it to dissipate heat more efficiently than other components and materials. The main features of the ATS-61290W-C1-R0 thermal heat sink are its optimized thermal performance at both low and high temperatures, low thermal resistance, reliable mounting solutions, and flexibility to accommodate various system requirements.
The ATS-61290W-C1-R0 thermal heat sink is constructed from a high-purity aluminum alloy, which has been machined into a variety of configurations to meet different application requirements. The aluminum alloy utilized by this thermal heat sink ensures excellent long-term thermal and mechanical stability. This heat sink is configured to satisfy a variety of application needs, and is especially useful for surface mounting as its built in mounting base allows for rapid integration into an existing system.
The ATS-61290W-C1-R0 thermal-heat sink is designed for efficient air cooling as well as liquid cooling. It is equipped with a high-performance fan or liquid cooling system, which can be used to dissipate heat and cool down the system effectively. The air cooling option includes a large axial fan which is designed to create a more uniform flow of air across the heat sink fins, resulting in more efficient heat transfer. For liquid cooling, the ATS-61290W-C1-R0 thermal-heat sink can be combined with a liquid-cooled radiator to provide a more effective source of thermal transfer.
The working principle of the ATS-61290W-C1-R0 thermal-heat sink is based on the concept of forced convection. The precise dimensions and structural design of this heat sink create an environment that facilitates optimum air flow, allowing for efficient heat transfer. The aluminum alloy used for its base and fins is designed to create an effective thermal transfer environment. The thermo-electric processors embedded in the fins help to transfer heat from the processor to the heat sink fins, which in turn transfers it to the cooling environment. Once the heat is transferred to the air or the coolant, it is dissipated and cooled.
The ATS-61290W-C1-R0 thermal-heat sink is ideal for a wide range of applications, including Intel and AMD processors, as well as high-end graphic cards. It can be used in CPUs, GPUs, or other electronics devices, and can provide efficient cooling in both high and low-temperature environments. This thermal-heat sink is easy to install, and offers maximum cooling efficiency, reliable operation, and high thermal performance.
The specific data is subject to PDF, and the above content is for reference