| Allicdata Part #: | ATS1452-ND |
| Manufacturer Part#: |
ATS-61310W-C1-R0 |
| Price: | $ 9.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 31X31X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61310W-C1-R0 Datasheet/PDF |
| Quantity: | 221 |
| 1 +: | $ 8.39160 |
| 10 +: | $ 7.99218 |
| 25 +: | $ 7.49245 |
| 50 +: | $ 7.24276 |
| 100 +: | $ 6.64329 |
| 250 +: | $ 6.24371 |
| 500 +: | $ 6.11883 |
| 1000 +: | $ 6.09384 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Discontinued at Digi-Key |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.220" (31.00mm) |
| Width: | 1.220" (31.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.65°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
The ATS-61310W-C1-R0 is a heat sink which is designed to transfer heat away from sensitive electrical components in order to keep them from overheating. Heat sinks are commonly used in electronics applications and the ATS-61310W-C1-R0 is a heavy-duty heat sink made of high-grade aluminum alloy with a black anodized finish.
The ATS-61310W-C1-R0 heat sink is designed for use in applications that require optimal thermal conductivity and low thermal resistance. It is designed with a large area and narrow pitch fins to maximize surface area and allow for increased air movement to provide effective heat dissipation. It has a compact design with an overall size of 13.1" x 11.2" x 4.4" that is ideal for densely populated PCBs or space-limited areas. The mounting hole pattern also allows for flexible installation onto different types of large integrated circuits.
In terms of working principle, the ATS-61310W-C1-R0 heat sink is designed to increase the surface area and therefore increase the rate of heat flow away from the components and into the environment. Heat is transferred from the hot component to the heat sink by conduction, which is the transfer of thermal energy through direct contact. Heat is then conducted from the heat sink to the environment by convection, which is the transfer of thermal energy through the movement of air. By increasing the surface area, the rate of heat transfer away from the component is increased, allowing the component to stay cooler for longer periods of time.
The main applications of the ATS-61310W-C1-R0 heat sink are in consumer electronic items such as laptops, desktop computers and other portable devices that require high-performance thermal management. It is also suitable for automotive, industrial and medical applications where thermal performance is of great importance. Additionally, the heat sink can be used in a wide range of electrical and electronic applications such as LED lighting, automotive electronics, DLP projectors, home theater systems and other high-performance machines.
In conclusion, the ATS-61310W-C1-R0 heat sink is a high-performance heat sink designed for maximum thermal conductivity. It has a compact design and is ideal for densely populated PCBs or space-limited areas. The heat sink is suitable for a wide range of applications such as consumer electronics, automotive, industrial and medical applications. It is also suitable for a variety of electrical and electronic applications where thermal performance is important.
The specific data is subject to PDF, and the above content is for reference