| Allicdata Part #: | ATS1431-ND |
| Manufacturer Part#: |
ATS-61325K-C1-R0 |
| Price: | $ 8.46 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 32.5X14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61325K-C1-R0 Datasheet/PDF |
| Quantity: | 96 |
| 1 +: | $ 7.68600 |
| 10 +: | $ 7.31997 |
| 25 +: | $ 6.86246 |
| 50 +: | $ 6.63377 |
| 100 +: | $ 6.08473 |
| 250 +: | $ 5.71873 |
| 500 +: | $ 5.60437 |
| 1000 +: | $ 5.58150 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.279" (32.50mm) |
| Width: | 1.279" (32.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.15°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-61325K-C1-R0 is a high-performance thermal-heat sink, designed for several specific applications. It provides a stable, reliable and efficient thermal-heat sink that can reduce power consumption, improve long-term stability and reliability and reduce system noise.
The ATS-61325K-C1-R0 is designed using advanced thermal-heat sink technologies, allowing it to provide excellent thermal performance. This high-performance heat sink features an optimized surface designed to dissipate greater amounts of heat, reducing hot spots and increasing performance. It also features a large area and larger number of pins for greater heat dissipation.
The design of the ATS-61325K-C1-R0 enables it to work with a range of applications, including cooling high-end processors, gaming systems, servers, workstations, and other electronics applications. It is designed to offer superior thermal performance by reducing temperature buildup and ensuring that the processor and other components are operating within acceptable temperatures.
The working principle of the ATS-61325K-C1-R0 is based on conduction-based thermal principles. When the unit is installed, the heat-conductive material between the cold plate and fin stack takes heat away from the processor. This heat is then transferred to the fin stack, which further transfers the heat away from the processor and into the environment.
The airflow generated by the fan or other cooling mechanisms is also used to dissipate the heat from the processor and into the environment. The fans or cooling mechanisms draw air from the environment, producing a temperature differential between inside and outside the heat sink, allowing for increased performance. The ATS-61325K-C1-R0 can also be combined with air and/or liquid cooling systems for even greater thermal performance.
The ATS-61325K-C1-R0 is suitable for use in a variety of environments. It is excellent for cooling data centers, server rooms, gaming systems, computers, and other heat-sensitive electronic equipment. It is also optimal for cooling high-end processors, as it allows them to reach their full performance potential without overheating.
The ATS-61325K-C1-R0 is designed for applications where a high degree of thermal management is required. Its advanced thermal-heat sink technologies allow it to provide superior thermal performance, enabling it to effectively reduce temperature buildup and maintain long-term stability and reliability.
The specific data is subject to PDF, and the above content is for reference