| Allicdata Part #: | ATS1442-ND |
| Manufacturer Part#: |
ATS-61325R-C1-R0 |
| Price: | $ 8.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 32.5X19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61325R-C1-R0 Datasheet/PDF |
| Quantity: | 77 |
| 1 +: | $ 7.96320 |
| 10 +: | $ 7.58457 |
| 25 +: | $ 7.11067 |
| 50 +: | $ 6.87368 |
| 100 +: | $ 6.30479 |
| 250 +: | $ 5.92556 |
| 500 +: | $ 5.80704 |
| 1000 +: | $ 5.78333 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.279" (32.50mm) |
| Width: | 1.279" (32.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management products are essential pieces of equipment for any electronics system. ATS-61325R-C1-R0 is one such product used in the field of thermal management. This thermal-heat sink from ATS System Technologies, Inc. is designed to handle high power electronics by taking excess heat away from components, allowing efficient operation and minimal loss of energy. In this article, we will examine the application field and working principle of the ATS-61325R-C1-R0.
The ATS-61325R-C1-R0 is designed for use in a variety of systems. It is commonly used in the military, aerospace, automotive, medical, and consumer electronics industries. In addition, it is suitable for applications that require high power density and require efficient cooling. The thermal-heat sink is designed to handle components such as high-powered field-effect transistors (FETs), integrated circuits (ICs), and processing units (PUs).
The ATS-61325R-C1-R0 is constructed with a copper heat spreader, a copper-wire flow-through pin fin design, and a variety of fins. These components help dissipate heat more efficiently. In addition, the thermal-heat sink has a two-piece, low-conductivity aluminum construction that helps minimize thermal resistance. This design enables the product to work in more extreme temperatures and provide better thermal performance.
The ATS-61325R-C1-R0\'s working principle is based on the process of heat transfer. Heat is transferred from the component to the thermal-heat sink via conduction. This process is accelerated by air convection, which causes the heat to be transported away from the component more quickly. The fins then act as radiators, dissipating the heat into the surrounding environment.
The ATS-61325R-C1-R0 is an excellent product for any thermal management system. It is able to handle high power components, dissipate heat more efficiently, and offer high levels of performance and reliability. In addition, its two-piece aluminum construction allows it to work in more extreme temperatures and provide better thermal performance.
In conclusion, the ATS-61325R-C1-R0 is a well-designed thermal-heat sink for use in many industries. Its copper heat spreader, copper-wire flow-through pin fin design, and variety of fins help dissipate heat more quickly and efficiently. Furthermore, its two-piece aluminum construction enables it to work in more extreme temperatures and provide better thermal performance. As such, it makes an ideal choice for any thermal management system.
The specific data is subject to PDF, and the above content is for reference