| Allicdata Part #: | ATS1421-ND |
| Manufacturer Part#: |
ATS-61330D-C1-R0 |
| Price: | $ 7.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 33X33X9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61330D-C1-R0 Datasheet/PDF |
| Quantity: | 85 |
| 1 +: | $ 7.24500 |
| 10 +: | $ 6.90228 |
| 25 +: | $ 6.47111 |
| 50 +: | $ 6.25552 |
| 100 +: | $ 5.73779 |
| 250 +: | $ 5.39265 |
| 500 +: | $ 5.28479 |
| 1000 +: | $ 5.26322 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal transfer solutions are important components in the electrical and electronic industries. ATS-61330D-C1-R0 is one of the most widely used thermal solutions available. This article will discuss the application field and working principle of ATS-61330D-C1-R0.
ATS-61330D-C1-R0 is a Thermal - Heat Sink that is designed for use in high-density electronic components and systems. It is a very effective thermal solution and is used in many applications where thermal solutions are needed. It features a low profile and is designed to be used in very tight spaces. It has a wide range of thermal characteristics and the ability to transfer heat quickly and efficiently. It can be used in applications where the heat may need to be transferred from the component to either the environment or another component.
The ATS-61330D-C1-R0 is an attractive and durable full-face heat sink. It is designed with an anodized aluminum surface to provide maximum heat transfer. It utilizes an efficient heat transfer design which is well suited for high-powered applications. It is also designed to be dust and moisture resistant and can be used in most industrial environments.
The working principle of ATS-61330D-C1-R0 is based on the process of heat transfer from the component to the heat sink. The heat generated by the component is absorbed by the heat sink and dissipated into the environment. This allows for maximum heat transfer and efficient cooling. The heat sink itself is designed to disperse the heat into the area and prevent the heat from damaging components. This heat transfer is done through a combination of convection, radiation and conduction which helps to dissipate the heat away from the component.
ATS-61330D-C1-R0 is one of the best thermal solutions available and is designed for many applications. It is a cost-effective, reliable, and efficient heat transfer solution. It is ideal for any application which needs a reliable and efficient heat transfer solution. It is strongly recommended for high-density electronic components and systems.
In conclusion, the ATS-61330D-C1-R0 Thermal - Heat Sink is a highly effective thermal solution for many applications. It is well suited for high-powered applications such as those found in high-density electronic components and systems. It is efficient and reliable and can provide the needed heat transfer and cooling for these components. Its anodized aluminum surface allows for maximum heat transfer and is dust and moisture resistant. Furthermore, it is a cost-effective and reliable solution which makes it an ideal choice for any application which needs a reliable and efficient thermal solution.
The specific data is subject to PDF, and the above content is for reference