| Allicdata Part #: | ATS2593-ND |
| Manufacturer Part#: |
ATS-61330W-C2-R0 |
| Price: | $ 9.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 33X33X24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61330W-C2-R0 Datasheet/PDF |
| Quantity: | 95 |
| 1 +: | $ 8.57430 |
| 10 +: | $ 8.16354 |
| 25 +: | $ 7.65352 |
| 50 +: | $ 7.39823 |
| 100 +: | $ 6.78598 |
| 250 +: | $ 6.37780 |
| 500 +: | $ 6.25026 |
| 1000 +: | $ 6.22474 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.55°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an important part of any thermal management system and the ATS-61330W-C2-R0 is no exception. This heat sink is a high-quality aluminum extrusion. It is designed to dissipate heat generated by electronic components in order to keep them cool and functioning properly. The ATS-61330W-C2-R0 is a great choice for a range of applications in the industrial, aerospace, and communication sectors. This article will discuss the applications and working principles of the ATS-61330W-C2-R0.
The ATS-61330W-C2-R0 is an aluminum extruded heat sink that is ideal for applications where a large surface area is necessary to dissipate the heat generated by high-power components. It has a wide range of mounting options and can be mounted horizontally, vertically, or even in a wall-mount configuration. It is also designed to provide superior cooling efficiency and longevity.
The ATS-61330W-C2-R0 is designed to achieve a high performance level by maximizing the surface area of the heat sink and the heat dissipation capacity. The heat sink is designed with a series of finned aluminum extrusions that are designed to facilitate the movement of air over the surface area. This allows for better exchange of heat, allowing components to remain cool and functioning properly. The aluminum extrusions are designed to be lightweight and act as a finned heat exchanger, allowing for maximum heat dissipation.
When it comes to the application of the ATS-61330W-C2-R0, there are numerous applications that can benefit from its use. Its design is well suited for electronics in the industrial, aerospace, and communications markets. In the industrial market, it can be used to cool components such as processors, mainboards, power supplies, and other electronic devices. It is also ideal for cooling circuit boards in aerospace applications, as well as high power amplifiers in communications scenarios. This heat sink is also ideal for cooling a wide range of high-performance components in consumer applications as well as industrial applications.
The working principle of the ATS-61330W-C2-R0 is based on the principle of heat dissipation. The heat sink utilizes its finned aluminum extrusions to allow air to move over the surface area of the heat sink. This helps to dissipate any excess heat generated by the components. The aluminum extrusions also help to spread the heat away from the heat source, assisting in overall thermal management. The installation of the heat sink is also relatively simple, as it is designed with mounting holes in the base plate for easy mounting onto any electronic device.
In conclusion, the ATS-61330W-C2-R0 is a high-performance heat sink designed for a range of electronic components in the industrial, aerospace, and communication industries. Its finned aluminum extrusions provide superior heat dissipation and allow for maximum air flow over its surface area. It is highly durable, lightweight, and easy to install, making it an excellent choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference