Allicdata Part #: | ATS2594-ND |
Manufacturer Part#: |
ATS-61350W-C2-R0 |
Price: | $ 9.48 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | MAXIGRIP FANSINK 35X35X24.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-61350W-C2-R0 Datasheet/PDF |
Quantity: | 100 |
1 +: | $ 8.61210 |
10 +: | $ 8.20449 |
25 +: | $ 7.69202 |
50 +: | $ 7.43554 |
100 +: | $ 6.82019 |
250 +: | $ 6.40993 |
500 +: | $ 6.28174 |
1000 +: | $ 6.25610 |
Series: | fanSINK, maxiGRIP |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip, Thermal Material |
Shape: | Square, Pin Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.965" (24.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 1.50°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are usually used to aid in cooling high-performance electronic components, and the ATS-61350W-C2-R0 is no exception. With its unique features, such as superior thermal performance, compact size, lightweight construction, and superior reliability, the ATS-61350W-C2-R0 can be used for a variety of applications.
At its core, the ATS-61350W-C2-R0 is designed to meet the specific demands of a variety of applications, such as cooling CPUs, GPU\'s, and other high performance electronic components. It is designed to dissipate heat from these components efficiently and quickly. It can even be used to cool other components, such as amplifiers, resistors, and transistors.
The ATS-61350W-C2-R0 has a unique design that helps it to quickly and evenly spread the heat energy away from the component surface, allowing for maximum heat dissipation. The shape of the sink also helps to reduce the amount of reflected heat. The air vents located around the edges of the sink also help to reduce the heat, by allowing outside air to flow over the sink.
The ATS-61350W-C2-R0 is constructed from high-grade aluminum alloy, which helps to dissipate heat quickly and efficiently. This also helps to increase the service life of the product significantly, by ensuring that it remains within its optimal temperature range and preventing it from overheating. The heat sink has been designed with a 3D fin design that helps to further optimize its thermal performance.
The air flow between the fins is further optimized by the use of specially designed louvers which allow air to move freely over the entire surface. This helps to ensure that the entire surface is evenly cooled, reducing the risk of overheating and ensuring that the heat sink can effectively dissipate the heat. Additionally, the ATS-61350W-C2-R0 is extremely lightweight and compact, making it ideal for use in a variety of applications.
In addition to the superior thermal performance of the ATS-61350W-C2-R0, its construction also ensures that it is extremely reliable. This is achieved through the use of a unique sealing system that prevents the heat sink from developing leaks or other potential defects. This ensures that the ATS-61350W-C2-R0 can be used for a variety of applications and remain effective for extended periods of time.
In conclusion, the ATS-61350W-C2-R0 is a unique heat sink designed to exceed the needs of a variety of applications. Its design allows it to efficiently and quickly dissipate the heat, while its lightweight construction makes it highly portable. Its 3D fin design further enhances its thermal performance, while its unique sealing system ensures that it remains reliable for extended periods of time. This makes it an ideal choice for cooling high-performance electronic components, cooling other components such as amplifiers, resistors, and transistors, and for a variety of other applications.
The specific data is subject to PDF, and the above content is for reference