| Allicdata Part #: | ATS1434-ND |
| Manufacturer Part#: |
ATS-61375K-C1-R0 |
| Price: | $ 8.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 37.5X14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61375K-C1-R0 Datasheet/PDF |
| Quantity: | 57 |
| 1 +: | $ 7.81200 |
| 10 +: | $ 7.44219 |
| 25 +: | $ 6.97712 |
| 50 +: | $ 6.74440 |
| 100 +: | $ 6.18629 |
| 250 +: | $ 5.81419 |
| 500 +: | $ 5.69791 |
| 1000 +: | $ 5.67465 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a significant figure in various electronic systems. It affects operational performance and the longevity of the system. Heat sinks constructed from materials with low thermal conductivity such as aluminum are used to dissipate heat away from sensitive components like processors, motors and power conversion circuitry. The ATS-61375K-C1-R0 is a heat sink designed with aluminum fins to provide a huge surface area for the heat to dissipate from the component.
The ATS-61375K-C1-R0 is designed with the practicality of several industrial applications in mind. It is most suitable for thermal dissipation of heat, voltage regulation, power control circuits and light TO-220 power converter packages. As such, it is often utilized in a wide range of industrial electronic applications such as switching power supplies, CPUs, displays, LED lighting systems, telecommunications and automotive.
ATS-61375K-C1-R0 has an innovative fin design that provides an increased surface area, which in turn enhances the dissipation of heat from the unit and the internal components of the circuitry. It offers a high level of cooling performance, disperses heat over a wide area, and has superior mechanical resistance, making it a reliable and cost-effective solution for thermal management applications.
The working principle of the ATS-61375K-C1-R0 is based on the natural convection cooling effect. The aluminum fins disposed on the heat sink act as a heat transfer medium in the convective process, converting heat energy to cooler air. The surrounding air is drawn upward along the fins, and as it passes by, it absorbs the heat from the contact area and dissipates it. As cooler air is drawn into the fins, more efficient and efficient cooling is achieved.
Apart from being highly effective for dissipating heat, the ATS-61375K-C1-R0 is also ultra-lightweight and compact, making it easy to install and transport. It has a 3 pin screw setting that provides firmness and reliability during installation. The fins on the heat sink are arranged in an optimal way so that the heat generated from the component is dispersed quickly, and the air circulates smoothly and efficiently.
The ATS-61375K-C1-R0 is manufactured to high standards and offers excellent value for money. It is cost-effective, reliable and ensures that heat produced from the electronics is dissipated quickly and efficiently. In addition, the heat sink has a long lifespan and a wide range of applications, making it an ideal choice for industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference