| Allicdata Part #: | ATS1445-ND |
| Manufacturer Part#: |
ATS-61375R-C1-R0 |
| Price: | $ 8.92 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 37.5X19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61375R-C1-R0 Datasheet/PDF |
| Quantity: | 95 |
| 1 +: | $ 8.10180 |
| 10 +: | $ 7.71687 |
| 25 +: | $ 7.23464 |
| 50 +: | $ 6.99363 |
| 100 +: | $ 6.41479 |
| 250 +: | $ 6.02895 |
| 500 +: | $ 5.90836 |
| 1000 +: | $ 5.88425 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.55°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks play an important role in the market for thermal solutions of electronic components. ATS-61375R-C1-R0 thermal heat sink is a device designed to dissipate the heat away from the component and keep the temperature well-controlled. In this article, we will explain the application field and working principle of the ATS-61375R-C1-R0 thermal heat sink.
Application Field
The ATS-61375R-C1-R0 thermal heat sink is primarily used for power transistors, power semiconductors, and IGBTs. It is an effective thermal control solution for these components since it efficiently dissipates the heat away from the components. The ATS-61375R-C1-R0 thermal heat sink also provides superior thermal performance and reduces the component’s junction temperature.
The ATS-61375R-C1-R0 thermal heat sink is also suitable for other components with significant amount of heat produced, such as high power LED components, voltage regulator circuits, video processors, and small motors. It is designed to provide improved heat dissipation compared to other thermal solutions.
Working Principle
The ATS-61375R-C1-R0 thermal heat sink uses an aluminum-finned heat sink, which increases the heat dissipation surface area. Heat is transferred from the heat-producing component to the sink fins by conduction. The fins then dissipate the heat to the surrounding environment via convection.
The ATS-61375R-C1-R0 thermal heat sink uses a passive cooling method, which means it does not require any active components for its operation. It relies solely on air convection, which is assisted by the heat sink’s fins and their shape. As air passes over the fins, the heat is quickly absorbed and dissipated into the environment.
The ATS-61375R-C1-R0 also uses a unique airflow cooling system, which improves the heat dissipation by directing the airflow in an optimized pattern. This system helps to increase the airflow across the heat-producing components, which further accelerates the heat transfer and helps to improve the thermal performance of the system.
The ATS-61375R-C1-R0 thermal heat sink is available in a variety of sizes and configurations which allow for versatile applications. It is an ideal thermal solution for components requiring significant heat dissipation in a variety of applications.
The specific data is subject to PDF, and the above content is for reference