| Allicdata Part #: | ATS1448-ND |
| Manufacturer Part#: |
ATS-61450R-C1-R0 |
| Price: | $ 9.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | MAXIGRIP FANSINK 45X45X19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-61450R-C1-R0 Datasheet/PDF |
| Quantity: | 28 |
| 1 +: | $ 8.30340 |
| 10 +: | $ 7.91028 |
| 25 +: | $ 7.41608 |
| 50 +: | $ 7.16891 |
| 100 +: | $ 6.57556 |
| 250 +: | $ 6.18008 |
| 500 +: | $ 6.05647 |
| 1000 +: | $ 6.03174 |
| Series: | fanSINK, maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Pin Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important consideration in electronic and electric equipment design and operation, as excessive heat can reduce the longevity and effectiveness of the components. There are numerous approaches to dissipating heat, but some of the most reliable and cost-effective solutions involve using heat sinks. ATS-61450R-C1-R0 is a high quality, cost-effective thermal/heat sink solution.
The ATS-61450R-C1-R0 is a reliable and durable thermal/heat sink solution designed to dissipate thermal energy generated by electronic components. It features an extruded aluminum base, copper heat pipes, and a cast aluminum fin construction, making it ideal for applications involving high power components such as CPUs, GPUs, and other integrated circuits.
The extruded aluminum base of the ATS-61450R-C1-R0 is designed to provide superior thermal performance by providing a low thermal resistance pathway for the heat energy to transfer from the component to the surrounding atmosphere. The thermal fins are designed to provide maximum surface area to transfer the heat from the component to the surrounding atmosphere. As the fins \'sink\' the heat, it is spread evenly over the device, allowing for maximum heat dissipation and energy efficiency.
The ATS-61450R-C1-R0 is the ideal solution for applications that require reliable thermal management. It is an effective solution for high power, mission critical applications such as radar systems, telecommunications systems, medical equipment, and server farms. The extruded aluminum base, copper heat pipes, and cast aluminum fin construction make it a highly reliable and economical solution for thermal management, and its low thermal resistance and efficient heat dissipation make it suitable for the most demanding applications.
The ATS-61450R-C1-R0 utilizes a two-stage cooling process with an internal heat pipe and an external fin array. The heat pipes transfer the heat from the component to the external fin array, which is then cooled by natural convection. The air surrounding the fins cools the component, and the heat is dissipated into the atmosphere. This process is called air cooling, and is one of the most efficient and reliable ways to dissipate heat.
The ATS-61450R-C1-R0 is an effective and reliable solution for thermal management and is suitable for a wide variety of applications. Its robust design, low thermal resistance, and efficient heat dissipation make it an ideal choice for mission-critical systems. The ATS-61450R-C1-R0 is a cost-effective and reliable solution for thermal management applications.
The specific data is subject to PDF, and the above content is for reference