| Allicdata Part #: | ATS1519-ND |
| Manufacturer Part#: |
ATS-CPX025025020-167-C2-R0 |
| Price: | $ 2.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB CP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-CPX025025020-167-C2-R0 Datasheet/PDF |
| Quantity: | 807 |
| 1 +: | $ 1.92150 |
| 10 +: | $ 1.87173 |
| 25 +: | $ 1.82120 |
| 50 +: | $ 1.71990 |
| 100 +: | $ 1.61872 |
| 250 +: | $ 1.51757 |
| 500 +: | $ 1.46699 |
| 1000 +: | $ 1.31523 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices used to dissipate heat away from electrical and electronic components, and are typically used in applications where cooling is critical. ATS-CPX025025020-167-C2-R0 is one such heat sink designed for use in high-power electronic components. This article will showcase the features of this product, as well as its application field and working principle.
Overview
The ATS-CPX025025020-167-C2-R0 heat sink is constructed of high grade aluminum with an extruded shape and crosscut fins. Its surface area is optimized to provide maximum heat dissipation, making it ideal for applications where cooling is critical. With an effective heat dissipation area of 1670 cm2, this heat sink is capable of dissipating up to 10 W of heat.
The product features a lip around the circumference of the outside edge, allowing for easy installation, as well as the ability to mount the product on a PCB without the need for additional mounting hardware. Additionally, the product is RoHS compliant and available in various sizes to meet the specific needs of the customer.
Application Field and Working Principle
The ATS-CPX025025020-167-C2-R0 is most commonly used in applications requiring cooling of high-power devices such as CPUs, GPUs, FPGAs, ASICs, or any other stationary or mobile electronic components. Due to the product\'s high heat dissipation capability of 10W, it can reliably dissipate heat away from these components while also keeping the surrounding environment cool.
The working principle of this heat sink is very simple; heat is conducted from the heated surface to the heat sink\'s surface, where it is then dissipated away through convection. As the heated surface becomes cooler, the heat sink\'s fins draw the surrounding air in and help direct the heat away from the component. This process is continued until the component\'s temperature is cooled to a safe level, ensuring that the component is functioning correctly.
Conclusion
The ATS-CPX025025020-167-C2-R0 is a high-quality and efficient heat sink designed for use in applications needing cooling of high-power electronic components. With an effective heat dissipation area of 1670 cm2 and a heat dissipation capability of 10W, this product provides reliable cooling performance. Additionally, the product\'s lip around the circumference of its edge ensures easy installation, as well as the ability to mount the product on a PCB without the need for additional hardware. As such, it is well suited for applications where reliable cooling is essential.
The specific data is subject to PDF, and the above content is for reference