ATS-CPX030030025-144-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS35934-ND

Manufacturer Part#:

ATS-CPX030030025-144-C3-R0

Price: $ 2.62
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X25MM L-TAB CP
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-CPX030030025-144-C3-R0 datasheetATS-CPX030030025-144-C3-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 2.38140
10 +: $ 2.31840
25 +: $ 2.25565
50 +: $ 2.13028
100 +: $ 2.00491
250 +: $ 1.87962
500 +: $ 1.81695
1000 +: $ 1.62899
Stock 1000Can Ship Immediately
$ 2.62
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.71°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-CPX030030025-144-C3-R0 is a type of thermal-heat sink and a crucial thermoelectric cooler component for a number of applications. Its main purpose is to regulate the temperature of components and devices operating at high temperatures as well as dissipating the generated heat. Heat sinks are widely used for industrial cooling and home appliances.

Among many other uses, thermal-heat sinks are used in air-conditioning, electronic devices such as CPUs and GPUs, automotive electronics, LED lighting, electronics boards, and power supplies. This particular ATS-CPX030030025-144-C3-R0 device is particularly used in applications that require a large capacity heat sink, with a great capability to dissipate heat in aggressive environments.

The main working concept behind a thermal-heat sink is a cooling system that dissipates the generated heat to keep temperatures stable. It is based on the simple fact that if a surface is exposed to a space with less energy than the energy of the surface itself, the surface will transfer the energy to that space. In other words, thermal-heat sinks are designed to provide a lower energy area that will serve as a sink for the energy generated from the heated components.

Commercially available thermal-heat sinks are made up of three main components: a cold plate, a heat spreader, and a fan. The cold plate sits on top of the heatsink to absorb and transfer heat away from the device. The heat spreader is an insulated material layer that helps to spread the heat near the cold plate to ensure that it is not all concentrated on one area.

The third component is the fan, which helps to pull out the generated heat from the heatsink and towards the environment. The fan sucks out the air that is heated up by the device, which is then exhausted out of the device. This helps to ensure that the temperature of the device does not exceed the maximum recommended operating temperature.

In addition, various types of thermal-heat sinks can be found depending on the application requirements. These include heat pipes, vapor chambers, and even liquid cooling. The main purpose of all of these types is to dissipate the generated heat in order to maintain a stable and reliable temperature within the device.

The ATS-CPX030030025-144-C3-R0 is a highly-effective thermal-heat sink for applications that require high heat dissipation capabilities. It is comfortable and highly durable, and therefore preferred for cooling electronic components in aggressive environments.

The specific data is subject to PDF, and the above content is for reference

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