| Allicdata Part #: | ATS35966-ND |
| Manufacturer Part#: |
ATS-CPX035035035-152-C3-R0 |
| Price: | $ 3.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB CP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-CPX035035035-152-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 2.75940 |
| 10 +: | $ 2.68695 |
| 25 +: | $ 2.61400 |
| 50 +: | $ 2.46884 |
| 100 +: | $ 2.32363 |
| 250 +: | $ 2.17841 |
| 500 +: | $ 2.10580 |
| 1000 +: | $ 1.88796 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management and heat sinks are an integral factor in maintaining the performance of systems involving high temperatures. The ATS-CPX035035035-152-C3-R0 heat sinks are designed to provide an efficient means of dissipating heat from systems operating in harsh environments. The combination of good thermal and mechanical properties makes them an ideal choice for applications in power supplies, semiconductor chips, and other high-power applications.
The ATS-CPX035035035-152-C3-R0 features a base of high quality aluminum setup to facilitate superior heat dissipation and a specially designed grille that enhances airflow over the surface. The base also includes an effective vacuum formed silicone rubber lip-seal that ensures maximum heat transfer and thermal protection. The top premium material of this heat sink is designed to maximize surface area to ensure effective heat transfer.
The ATS-CPX035035035-152-C3-R0 heat sinks are designed to meet the high operational requirements of a large variety of industrial and military applications. As well, they are compatible with various surface mount components requiring efficient thermal management. The unique characteristics of the heat sink make it suitable for a number of applications, including power transistors, power MOSFETs, IGBTs, SCRs, and other sensitive components.
ATS-CPX035035035-152-C3-R0 heat sinks are most effective when used with forced air cooling systems, providing excellent thermal protection while reducing the formation of hot spots and maintaining an even temperature throughout the device or system. The cooling efficiency of the ATS-CPX035035035-152-C3-R0 is further enhanced by its multi-layer construction, which allows for easy airflow and improved heat transfer.
The ATS-CPX035035035-152-C3-R0 is an essential choice for engineers who require a heat sink that can provide increased performance and maximum thermal protection in the most demanding applications. The combination of superior performance and optimized dimensions make the ATS-CPX035035035-152-C3-R0 an ideal choice for heat sinks in many applications. This versatile heat sink is available in a range of sizes and is suitable for a variety of mounting requirements.
The specific data is subject to PDF, and the above content is for reference