ATS-CPX050050010-121-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal - Heat Sinks are components that are designed to regulate and dissipate the heat generated by electronic devices and components. ATS-CPX050050010-121-C2-R0 belongs to this category, and its application field as well as working principle will be elaborated in the following sections.

Application Field

ATS-CPX050050010-121-C2-R0 is a heat sink ideal for applications such as power supplies and circuit boards. When it is used in power supplies, it plays an important role in dissipating heat away from the device, thus helping to increase reliability and prolong its life. In addition, the ATS-CPX050050010-121-C2-R0 heat sink is also suitable for circuit boards, especially those with high power components such as FETs, drivers, and other miniaturized areas. It is used to reduce the temperature of the components and prevent component damage caused by high temperatures.

Working Principle

The ATS-CPX050050010-121-C2-R0 heat sink uses a process called "convection cooling" to cool the components. In this process, a fan is used to draw air across the heat sink\'s design-fill openings,producing a continuous convection flow around the components. The air flow generated by the fan removes the heat generated by the components and disperses it into the surrounding environment. The convection cooling process can effectively reduce component temperatures and prevent component overheating.In addition, the ATS-CPX050050010-121-C2-R0 heat sink also utilizes an advanced thermal-grade material to further enhance heat dissipation. This material, which has lower thermal resistance than regular aluminum materials, helps to further improve component cooling efficiency. The use of this material also ensures that the heat sink remains robust and reliable even after prolonged use.

Conclusion

The ATS-CPX050050010-121-C2-R0 heat sink is a reliable and versatile component for thermal management of various electronic devices and components. It features a unique design that is optimized for convection cooling, as well as an advanced thermal-grade material to further enhance heat dissipation. This heat sink is particularly suitable for applications such as power supplies and circuit boards, providing effective cooling and helping to prolong the lifespan of the components.

The specific data is subject to PDF, and the above content is for reference