| Allicdata Part #: | ATS36048-ND |
| Manufacturer Part#: |
ATS-CPX050050010-121-C3-R0 |
| Price: | $ 2.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT CP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-CPX050050010-121-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 2.26170 |
| 10 +: | $ 2.19933 |
| 25 +: | $ 2.13998 |
| 50 +: | $ 2.02104 |
| 100 +: | $ 1.90210 |
| 250 +: | $ 1.78323 |
| 500 +: | $ 1.72378 |
| 1000 +: | $ 1.54545 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-CPX050050010-121-C3-R0 is a high performance heat sink that is designed to provide efficient thermal management in a variety of applications. It is constructed from strong aluminum alloy and is capable of dissipating up to 500W of heat. The ATS-CPX050050010-121-C3-R0 heat sink is designed to be installed on a circuit board and is suitable for surface or through-hole mounting.
Working Principle
The working principle behind heat sinks is simple. Heat sinks are designed to absorb and disperse heat from components on a circuit board, ensuring that the components do not overheat and become damaged. Heat sinks are typically composed of aluminum alloys, such as aluminum oxide or aluminum aluminum alloy. These materials are highly effective at absorbing and dissipating heat, allowing them to efficiently dissipate heat from components on the board.
Applications
The ATS-CPX050050010-121-C3-R0 heat sink is designed for a wide range of applications. It is particularly well-suited for use in high-power semiconductors that require efficient thermal management. Additionally, it can be used in PCBs with multiple components, such as surface-mount devices, as well as in high-frequency applications. The ATS-CPX050050010-121-C3-R0 has been tested and certified to meet industry standards for both performance and safety.
Installation
Installing the ATS-CPX050050010-121-C3-R0 heat sink is relatively simple. The heat sink should be mounted directly on the PCB’s surface. It should then be secured using four screws, two of which should be inserted into the mounting holes on either side of the heat sink. Once the heat sink is firmly in place, it should be connected to the PCB’s power source. This can be achieved by connecting the heat sink’s tension clips to either the positive or negative power supply pins.
Conclusion
The ATS-CPX050050010-121-C3-R0 is a high quality heat sink that is designed to provide efficient thermal management in a variety of applications. It is constructed from strong aluminum alloy and is capable of dissipating up to 500W of heat. The heat sink can be easily installed on a PCB and is capable of providing reliable thermal management in high-power applications. As such, it is an ideal choice for those in need of a reliable, high performance heat sink.
The specific data is subject to PDF, and the above content is for reference