ATS-EXL72-300-R0 Allicdata Electronics
Allicdata Part #:

ATS2195-ND

Manufacturer Part#:

ATS-EXL72-300-R0

Price: $ 13.71
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK AL6063 300X41X7MM
More Detail: Heat Sink Aluminum Top Mount
DataSheet: ATS-EXL72-300-R0 datasheetATS-EXL72-300-R0 Datasheet/PDF
Quantity: 11
1 +: $ 12.46140
10 +: $ 11.76900
25 +: $ 11.07670
50 +: $ 10.38440
100 +: $ 9.69213
250 +: $ 8.99983
500 +: $ 8.82672
Stock 11Can Ship Immediately
$ 13.71
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: --
Attachment Method: Adhesive
Shape: Rectangular, Fins
Length: 11.811" (300.00mm)
Width: 1.614" (41.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.275" (7.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 47.40°C/W
Material: Aluminum
Material Finish: Degreased
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are essential to ensure proper performance, reliability, and longevity of all electronics, regardless of their purpose. One type of thermal solution is a heat sink. ATS-EXL72-300-R0 is a leading heat sink, capable of dissipating high levels of thermal power. In this article, we will discuss the application fields and working principles of ATS-EXL72-300-R0.

Application fields

ATS-EXL72-300-R0 is a high-performance, low-profile, advanced heat sink with robust construction and excellent cooling characteristics. It is designed to improve the thermal performance of today’s electronic systems, making it an ideal choice for a variety of applications. Its application fields include:

  • Power converters
  • High-reliability systems
  • Automotive electronics
  • Consumer electronics
  • Heat-generating CPUs
  • Military/aerospace applications
  • Telecommunications applications

ATS-EXL72-300-R0 is also used in the medical device, IT, data storage, and gaming industries. Its versatility and thermal performance make it well-suited for a range of application fields.

Working principle

The working principle of ATS-EXL72-300-R0 heat sink is based on the principles of thermal communication between its surface and the electronic components. This efficient heat transfer occurs due to two methods: conduction and convection. Heat generated by the components is absorbed by the heat sink and then dissipated to the surrounding environment.

The heat sink is also designed to receive maximum airflow, which helps to ensure effective heat dissipation. This is accomplished through an array of features, such as air cooling fins, which provide surface area for air to flow over the heat sink and allow for greater cooling efficiency. Additionally, ATS-EXL72-300-R0 features air dams which reduce the turbulence of the airflow, allowing the air to be directed in a specific way, satisfying the system’s thermal cooling requirements.

To ensure reliable performance in higher-temperature environments, ATS-EXL72-300-R0 includes a unique “sleeve-type” construction, which increases the surface area of the heat sink in order to maximize heat dissipation. This is essential for applications that require high-power dissipation. Additionally, the heat sink is made with a high quality aluminum alloy, which provides excellent thermal conductivity.

Conclusion

ATS-EXL72-300-R0 is a high-performance, low-profile heat sink that offers superior thermal performance in a variety of application fields. It features a unique “sleeve-type” construction to maximize the surface area and improve heat dissipation, as well as air cooling fins and air dams to channel the airflow for optimal thermal transfer. Furthermore, it utilizes a high-quality aluminum alloy with excellent thermal conductivity. With these features, ATS-EXL72-300-R0 is an ideal choice for applications that require reliable thermal management.

The specific data is subject to PDF, and the above content is for reference

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