| Allicdata Part #: | ATS2202-ND |
| Manufacturer Part#: |
ATS-EXL74-300-R0 |
| Price: | $ 24.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK AL6063 300X70X15MM |
| More Detail: | Heat Sink Aluminum Top Mount, Extrusion |
| DataSheet: |  ATS-EXL74-300-R0 Datasheet/PDF |
| Quantity: | 145 |
| 1 +: | $ 22.67370 |
| 10 +: | $ 21.33870 |
| 25 +: | $ 20.00530 |
| 50 +: | $ 18.67160 |
| 100 +: | $ 18.00480 |
| 250 +: | $ 17.00450 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount, Extrusion |
| Package Cooled: | -- |
| Attachment Method: | Adhesive |
| Shape: | Rectangular, Fins |
| Length: | 11.811" (300.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 18.20°C/W |
| Material: | Aluminum |
| Material Finish: | Degreased |
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Thermal - Heat Sinks have become essential components in the electronics industry today. There are a variety of different heat sinks on the market, and the ATS-EXL74-300-R0 is one such example. This particular heat sink is designed for use in applications where it must dissipate even higher levels of heat, and so may be used in heaving computing or telecom applications.
The ATS-EXL74-300-R0 is a flexible heat sink with four slots meant to allow the user to customize the shape and cooling capability to their own needs. It is likewise capable of dissipating both air and liquid-borne heat, making it useful for high-end cooling applications. In addition, the fin spacing is designed with a 0.25 inch pitch, meaning that the thermal resistance of the heat sink is greatly reduced.
In order to ensure that the component has the necessary thermal capacity, the heat sink is constructed from a material known as “Alumonium”, which is an aluminium alloy known for its thermal conductive properties. This ensures that the heat sink is capable of dissipating even greater levels of heat than simpler heat sinks. The baseplate of the heat sink is likewise made from aluminium, ensuring good contact between the heat sink and the component.
In addition, the ATS-EXL74-300-R0 also uses flexible heat pipes, meaning that the heat is quickly transferred away from the component. This further reduces thermal resistance, meaning that the component receives less heat and is able to operate with a greater degree of stability. The heat pipes are also designed with a corrugated structure, which aids in diffusing the air inside the heat sink.
The main application fields for the ATS-EXL74-300-R0 are high performance computing, telecoms, and electronics. These industries require components which need to be kept cool, and the ATS-EXL74-300-R0 is well-suited to meet this requirement, with its capability to dissipate air and liquid-borne heat. Furthermore, the heat pipes and aluminium baseplate ensure that the component is effectively cooled and can operate at greater levels of reliability.
In summary, the ATS-EXL74-300-R0 is a highly effective heat sink designed for cooling applications in telecommunication, high performance computing, or electronics. Its aluminium alloy material and corrugated heat pipes are designed in such a way to ensure efficient heat dissipation, and its four slots allow it to be adapted to be used with any design. Ultimately, the ATS-EXL74-300-R0 provides users with a reliable and efficient method of cooling even the most demanding of applications.
The specific data is subject to PDF, and the above content is for reference