| Allicdata Part #: | ATS1620-ND |
| Manufacturer Part#: |
ATS-FPS058061006-39-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X5.84MM FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPS058061006-39-C2-R0 Datasheet/PDF |
| Quantity: | 59 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.33144 |
| 25 +: | $ 3.24122 |
| 50 +: | $ 3.06130 |
| 100 +: | $ 2.88118 |
| 250 +: | $ 2.70109 |
| 500 +: | $ 2.61106 |
| 1000 +: | $ 2.34095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical element of any electronic application, and the design and selection of heat sinks is of utmost importance. There are a number of considerations to account for, and the ATS-FPS058061006-39-C2-R0 thermal heat sink is an ideal solution for many applications.
The ATS-FPS058061006-39-C2-R0 thermal heat sink has several features that make it an ideal solution for many different applications. At its most basic, the heat sink is designed to dissipate heat away from a device or system as efficiently as possible, while also keeping the device or system cool.
The heat sink is designed to dissipate heat from both sides with a curved, 90-degree fin design. This design allows for more efficient heat dissipation from both sides, with the heat dissipating into the ambient air. The heat sink is constructed from aluminum, with a copper vapor chamber at the center of the fin. The aluminum body acts as a heat spreader, with the copper vapor chamber providing additional thermal transfer and cooling capabilities.
The heat sink also has a fin density of 5 fins/cm2, which helps to increase heat dissipation by allowing more air movement through the fins. This helps to move the heat away from the device or system more quickly. The heat sink also features a thermal resistance of 0.11 °C/W, which is the most efficient thermal resistance available for cooling applications.
The ATS-FPS058061006-39-C2-R0 thermal heat sink is designed for a variety of applications, such as LED lighting, digital signage, and automotive electronics. It is also ideal for applications that require high temperature control, such as medical equipment, embedded power supplies, and telecommunications equipment.
The heat sink is also designed with safety in mind. The aluminum body is flame retardant and the copper vapor chamber can withstand temperatures up to 200 °C. The heat sink is also designed to be dust resistant, with the fins sealed to prevent particles from entering the aluminum body.
Since the ATS-FPS058061006-39-C2-R0 thermal heat sink is so versatile, it can be used in many different applications. It can be used to cool components such as processors, memory chips, and GPUs. It can also be used in industrial applications such as machining centers, where it can help to keep the machine cool during long-term operation.
When selecting a heat sink for a specific application, it is important to consider the amount of thermal resistance and the airflow through the fins. The ATS-FPS058061006-39-C2-R0 thermal heat sink provides an optimal combination of these elements, making it an ideal choice for many applications.
The specific data is subject to PDF, and the above content is for reference