| Allicdata Part #: | ATS-FPS058061006-39-C3-R0-ND |
| Manufacturer Part#: |
ATS-FPS058061006-39-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X5.84MM FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPS058061006-39-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal applications such as electronics require heat sinks to be used in order to dissipate the heat that is generated. The most common type of heat sink used is the ATS-FPS058061006-39-C3-R0, which is a highly efficient heat dissipator. This heat sink is designed to accommodate the needs of any application and is designed to optimize the heat dissipation. In this article, we will discuss the application of the ATS-FPS058061006-39-C3-R0 heat sink and its working principle.
The ATS-FPS058061006-39-C3-R0 heat sink is designed for applications requiring efficient cooling of electronic components. This heat sink is made from anodized aluminum and has thermal fins for improved heat dissipation. The ATS-FPS058061006-39-C3-R0 offers excellent heat dissipation performance and is ideal for use in a variety of applications. The design of the ATS-FPS058061006-39-C3-R0 provides up to 6 fins per inch along its surface area for maximum heat dissipation. This heat sink is suitable for use in applications where heat is generated heavily or high temperatures need to be maintained.
The ATS-FPS058061006-39-C3-R0 heat sink is designed to provide optimal cooling performance with its anodized aluminum construction. This heat sink is also capable of withstanding high temperatures, making it an ideal choice for use with higher powered electronics. The ATS-FPS058061006-39-C3-R0 also features a unique fin design that allows for improved air flow and maximum heat dissipation. This heat sink is designed to be durable and is capable of withstanding long-term temperature variations. The design of the ATS-FPS058061006-39-C3-R0 also makes it an ideal choice for use in a variety of different environments.
The ATS-FPS058061006-39-C3-R0 heat sink is designed to operate using a simple yet efficient working principle. This heat sink is designed to dissipate the generated heat by dissipating the air surrounding it and cooling the hot air by using its fins. This heat sink is designed to be installed in an area that can support the heat generated by the device that it is installed in. The ATS-FPS058061006-39-C3-R0 utilizes a combination of convective and conductive thermal transfer to ensure that it can effectively dissipate the heat into the surrounding air. This allows for efficient cooling of the device while still maintaining the temperature in the area around it.
In conclusion, the ATS-FPS058061006-39-C3-R0 heat sink is an ideal choice for any application requiring efficient cooling. Its unique design is optimized to provide maximum performance and is capable of withstanding high temperatures. Additionally, the ATS-FPS058061006-39-C3-R0 utilizes a simple yet efficient working principle that allows it to dissipate the heat generated by the device without impacting the temperature of the surrounding air. This heat sink is designed to be an ideal solution for use in a variety of thermal applications and is suitable for use in both indoor and outdoor environments.
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