| Allicdata Part #: | ATS1621-ND |
| Manufacturer Part#: |
ATS-FPS058061011-40-C2-R0 |
| Price: | $ 4.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPS058061011-40-C2-R0 Datasheet/PDF |
| Quantity: | 60 |
| 1 +: | $ 3.66030 |
| 10 +: | $ 3.56202 |
| 25 +: | $ 3.36420 |
| 50 +: | $ 3.16625 |
| 100 +: | $ 2.96837 |
| 250 +: | $ 2.77046 |
| 500 +: | $ 2.57257 |
| 1000 +: | $ 2.52309 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Today\'s electronic components have high power and large consumption, which requires an efficient cooling mechanism. Heat sinks are one of the most popular cooling solutions, and ATS-FPS058061011-40-C2-R0 is a type of heat sink designed for use in a variety of electronic applications. This section will discuss the application field and working principle of this heat sink.
Application Field
The ATS-FPS058061011-40-C2-R0 heat sink can be used in a wide range of applications, including power supplies, amplifiers, medical imaging devices, lasers, and industrial machinery. It is ideal for applications that require high power dissipation and reliable cooling in a compact package. The heat sink is made of aluminum, which is known for its excellent heat transfer and corrosion resistance properties.
Working Principle
Heat sinks transfer heat away from their electronic components by using a combination of convection, radiation, and conduction. When the heat sink is in operation, the heat from the electronic components is spread across the surface of the heat sink, where it is dissipated into the ambient air. The fins on the heat sink increase the surface area, which increases the rate of heat dissipation. In addition, a fan can be used to increase the rate of heat loss by circulating outside air over the fins.
The ATS-FPS058061011-40-C2-R0 heat sink is designed to provide efficient and reliable cooling for a range of electronic devices. The aluminum construction ensures excellent heat transfer and corrosion resistance, while the fin design ensures maximum heat dissipation. With this combination of design features, the heat sink is a perfect choice for a variety of high-power applications.
The specific data is subject to PDF, and the above content is for reference