| Allicdata Part #: | ATS1624-ND |
| Manufacturer Part#: |
ATS-FPX025025010-43-C2-R0 |
| Price: | $ 2.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPX025025010-43-C2-R0 Datasheet/PDF |
| Quantity: | 166 |
| 1 +: | $ 1.92150 |
| 10 +: | $ 1.87173 |
| 25 +: | $ 1.82120 |
| 50 +: | $ 1.71990 |
| 100 +: | $ 1.61872 |
| 250 +: | $ 1.51757 |
| 500 +: | $ 1.46699 |
| 1000 +: | $ 1.31523 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal or Heat Sinks are components used to dissipate the heat generated by electronic components in order to improve their thermal management. ATS-FPX025025010-43-C2-R0 is one of such thermal/heat sinks, which has been designed to dissipate the heat and keep components running at the optimal temperature.
ATS-FPX025025010-43-C2-R0 is a finned type aluminum thermal/heat sink, which has been designed to increase air flow and reduce the surface contact temperature, thus improving the thermal performance of the component. This thermal/heat sink has a fin height of 0.25in (6.35mm), a fin width of 0.040in (1.02mm), an overall length of 4.3in (109.2mm) and an overall width of 2.2in (55.9mm). It also has a mountable hole diameter of 0.140in (3.56mm).
This thermal/heat sink is suitable for a wide range of applications. It can be used in medical imaging, industrial automation, automotive electronics, computer cooling, power LED lighting, and other similar applications. Its low profile design makes it ideal for applications that require a small device to fit into a confined space.
The working principle of this thermal/heat sink is quite simple. The device has fins that are spaced apart so that the air can easily pass between them. As the heat from the component is conducted to the thermal/heat sink, the air around the fins will be heated and rise, which creates a temperature gradient (hot air leading upwards, cool air circulating down). As the cool air reaches the hot air from the component, a convective current is created, and this helps to dissipate the heat from the component into the atmosphere.
This thermal/heat sink is also designed for easy installation and requires very minimal maintenance. It can be easily mounted onto a PCB or any other enclosure using the mountable hole. Additionally, this thermal/heat sink can be easily cleaned with isopropyl alcohol or any other cleaning solution.
Overall, this thermal/heat sink provides an effective thermal management solution for a wide range of applications. It is suitable for applications that require low profile components that will not take up too much space. Moreover, its simple installation and low maintenance make it a great choice for those looking for an easy and efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference