| Allicdata Part #: | ATS36103-ND |
| Manufacturer Part#: |
ATS-FPX025025010-73-C3-R0 |
| Price: | $ 2.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPX025025010-73-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 1.90260 |
| 10 +: | $ 1.85472 |
| 25 +: | $ 1.80432 |
| 50 +: | $ 1.70415 |
| 100 +: | $ 1.60392 |
| 250 +: | $ 1.50368 |
| 500 +: | $ 1.45356 |
| 1000 +: | $ 1.30319 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 29.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks technology is an important and integral part of many commercial and industrial operations. The ATS-FPX025025010-73-C3-R0 heat sink is a great example of this technology. Understanding the application field and working principle of this heat sink is key to getting the most out of its performance and ensuring quality results.
The ATS-FPX025025010-73-C3-R0 heat sink is designed to dissipate heat away from the source of the heat, such as a circuit board, computer processor, or any other component that generates heat such as a motor or amplifier. This type of heat sink usually consists of a metal sheet, such as aluminum, with fins on the top side. The shape of the fins helps to divert heat away from the source as air passes over the heat sink surface. The material of which the fins are made also helps to absorb heat and diffuses it as it travels away. This allows the heat to be distributed evenly over the entire heat sink surface.
The application field for the ATS-FPX025025010-73-C3-R0 heat sink is vast and can be used in many commercial and industrial operations. One of the most common application is thermal management on a printed circuit board. Heat sinks are used to dissipate the heat generated by the components on the circuit board and help to increase the overall efficiency of the system. Heat sinks are also used on components such as motors, amplifiers, and computer processors, as well as in industrial machinery. This type of heat sink can be used in automotive and aerospace industries as well.
Another important application field for the ATS-FPX025025010-73-C3-R0 heat sink is in data centers. Heat sinks are increasingly used in data centers to help cool the servers and keep the environment at an optimal temperature. Heat sinks are also used to dissipate the heat generated by the servers so that the systems can continue to function without over-heating and risking damage.
The working principle of a heat sink is fairly simple. Heat sink technology is a process where the heat generated from a component is absorbed and radiated away by a metal sheet, such as aluminum or copper, or by a material such as plastic. This metal sheet typically has fins on the top and is connected to the heat source. As air passes over the fins it absorbs the heat from the metal and diffuses it away. This allows the heat to dissipate away from the heat source and into the environment, aiding in the efficient cooling of the component.
The ATS-FPX025025010-73-C3-R0 heat sink is a great example of how thermal-heat sink technology can help with thermal management in commercial and industrial operations. Knowing and understanding the application field and working principle of the heat sink is key to ensuring the best performance and results.
The specific data is subject to PDF, and the above content is for reference