| Allicdata Part #: | ATS1635-ND |
| Manufacturer Part#: |
ATS-FPX025025035-78-C2-R0 |
| Price: | $ 2.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM R-TAB FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPX025025035-78-C2-R0 Datasheet/PDF |
| Quantity: | 137 |
| 1 +: | $ 2.46330 |
| 10 +: | $ 2.40156 |
| 25 +: | $ 2.33654 |
| 50 +: | $ 2.20664 |
| 100 +: | $ 2.07686 |
| 250 +: | $ 1.94708 |
| 500 +: | $ 1.88217 |
| 1000 +: | $ 1.68747 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Introduction to Thermal - Heat Sinks
Thermal-Heat Sinks are incredibly efficient heat transfer components commonly used in semiconductor applications. They are specially designed to absorb and dissipate heat away from vital components to prevent them from overheating. The ATS-FPX025025035-78-C2-R0 is a specialized type of heat sink most commonly used in high-efficiency electronics. In this article, we will cover the applications and working principles of the ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink.Application of ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink
The ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink is designed for use in high-efficiency electronics applications, such as:- Computer processors
- Microcontrollers
- Power supplies
- Telecom and networking routers
- Industrial automation controllers
- PCB components
Working Principle of ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink
The ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink is designed using an efficient heat conducting and dissipating material, such as aluminum or copper. It consists of a thermal pad attached to the component to absorb the heat, and a metal heat sink base or finned heatsink that is used to dissipate the heat away.The key function of the ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink is to transfer heat from the component to the environment while minimizing power losses. To achieve this, the thermal pad is attached to the component and the base of the heat sink is then attached to the thermal pad. The metal fins of the heat sink then dissipate the heat from the component to the air. The ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink is a highly efficient and effective heat transfer mechanism. It is much larger than traditional heat sinks, allowing it to dissipate heat more efficiently and reduce the heat generated by the component significantly.Conclusion
The ATS-FPX025025035-78-C2-R0 Thermal - Heat Sink is an invaluable component for high-efficiency electronics applications. It draws the heat away from critical components and dissipates it efficiently. This reduces the overall thermal load on the electronics system, allowing it to operate at its most efficient level.The specific data is subject to PDF, and the above content is for reference
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