| Allicdata Part #: | ATS36163-ND |
| Manufacturer Part#: |
ATS-FPX035035025-88-C3-R0 |
| Price: | $ 2.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPX035035025-88-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 2.52630 |
| 10 +: | $ 2.46078 |
| 25 +: | $ 2.39425 |
| 50 +: | $ 2.26132 |
| 100 +: | $ 2.12827 |
| 250 +: | $ 1.99529 |
| 500 +: | $ 1.92877 |
| 1000 +: | $ 1.72924 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a device designed to dissipate excess thermal energy generated by an electronic component or group of components, thus cooling the component. Thermal management systems are used to improve the overall reliability and performance of the components they protect from harmful environmental conditions. The ATS-FPX035035025-88-C3-R0 is a specific type of heat sink designed for a wide range of applications, and its working principle is designed to improve performance and dissipate heat efficiently.
Application of ATS-FPX035035025-88-C3-R0 Heat Sink:
The ATS-FPX035035025-88-C3-R0 thermal management system has the dual function of both thermal management and fan speed regulation. It is most commonly used as a heat sink for high-powered processors, but can also be applied to CPUs, GPUs, motherboards, video cards, and any other electronics with high or medium power densities. This heat sink is also suitable for higher-end consumer applications that require efficient heat dissipation. The robust construction of this heat sink ensures that it is well suited for many commercial environments as well.
The highlights of the ATS-FPX035035025-88-C3-R0 thermal management system include its lightweight design, improved cooling performance, advanced thermal management capability, and improved system aesthetics. It has a wide range of mounting options, and its fan speed control provides high efficiency and improves overall system stability. It has also been designed for compatibility with both Intel and AMD processors.
Working Principle of ATS-FPX035035025-88-C3-R0 Heat Sink:
The ATS-FPX035035025-88-C3-R0 heat sink works by transferring the heat generated by an electronic component or group of components away from the component and dissipating it into the surrounding air or environment. This thermal management system makes use of an optimized combination of natural convection and fan-forced air to effectively dissipate the heat away from the heat source. It also uses a high-efficiency fan speed control system to improve the overall efficiency and stability of the system.
The ATS-FPX035035025-88-C3-R0 features two variable-speed fans, each of which has its own independent speed control. This allows it to keep the heat dissipated by the electronic components to a minimum while still providing adequate cooling. The fans are also designed to efficiently draw in air and reduce noise levels, ensuring that the electrical components are not subjected to too much external noise. The fan speed control feature also ensures that the fan runs more quietly.
The design of the heat sink also features a large contact area to ensure that the heat is dissipated evenly and without hot spots. The ATS-FPX035035025-88-C3-R0 also features a low air pressure drop, ensuring that cooling efficiency is maximized. This thermal management system also includes integrated mounting brackets, allowing easy installation and removal.
In addition to dissipating heat, this thermal management system also provides the user with an aesthetically pleasing solution as well. The sleek black finish of the heat sink allows it to blend in with other components in the system. This also provides an improved system for appearance.
Conclusion:
The ATS-FPX035035025-88-C3-R0 heat sink is specifically designed to offer superior thermal management and fan speed regulation. The combination of natural convection, fan-forced air, and fan speed control ensures that the heat generated by electronic components is dissipated away from those components quickly and efficiently. The heat sink is also designed for compatibility with Intel and AMD processors, and is suitable for both consumer and commercial applications. In addition, the sleek black finish ensures that the design of the heat sink fits in seamlessly with other parts of the system.
The specific data is subject to PDF, and the above content is for reference