ATS-FPX035035030-89-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.91°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal Heat SinksThermal heat sinks are devices that are designed to absorb and dissipate the heat generated by electronic components. Thermal heat sinks are used in various applications, from computers and cell phones to medical and industrial equipment. Thermal heat sinks are typically composed of an array of fins that are exposed to air, water or other cooling mediums. The design of a thermal heat sink is an important factor in the overall efficiency of a system and its ability to dissipate heat efficiently.ATS-FPX035035030-89-C1-R0 Heat Sink: Application Field and Working PrincipleThe ATS-FPX035035030-89-C1-R0 heat sink is a high thermal capacity, low profile heat sink specifically designed for use in applications with confined space. This thermal heat sink provides good thermal performance and is suitable for cooling of a variety of devices. It features a Black Anodized Aluminum construction that provides corrosion resistance as well as excellent heat dissipation.The ATS-FPX035035030-89-C1-R0 uses a simple yet efficient design that enables it to dissipate heat quickly and evenly. The thermal heat sink is equipped with an array of aluminum fins that draw the heat away from the device and into the surrounding air. The number of fins and their size is optimized for each application and can vary greatly.The fins are connected to an aluminum heat sink base through a series of copper pins. The base also acts as the heat spreader, distributing the heat away from the device and dissipating it away from the system. As the air passes through and around the fins, it extracts the heat from the heat sink surface and the ambient air cools the heat sink. This method of cooling increases the efficiency of the heat transfer process and reduces the amount of energy required to maintain the device’s temperature.In addition to a standard base, the ATS-FPX035035030-89-C1-R0 heat sink features a special adhesive tape that allows it to be conveniently attached to a heat-generating device. This tape facilitates the quick and easy installation of the heat sink and provides improved heat dissipation. It also provides a highly effective thermal interface between the device and the heat sink, thus improving thermal performance.The ATS-FPX035035030-89-C1-R0 heat sink is an excellent choice for applications that require a low profile, high thermal capacity, and efficient cooling performance. Its efficient design and ease of installation make it a great choice for all applications where space is limited and temperature control is critical. With its robust design and impressive cooling performance, the ATS-FPX035035030-89-C1-R0 is sure to meet the thermal needs of any application.

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