| Allicdata Part #: | ATS1657-ND |
| Manufacturer Part#: |
ATS-FPX035035030-89-C2-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB FP |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-FPX035035030-89-C2-R0 Datasheet/PDF |
| Quantity: | 165 |
| 1 +: | $ 3.02400 |
| 10 +: | $ 2.94273 |
| 25 +: | $ 2.86348 |
| 50 +: | $ 2.70434 |
| 100 +: | $ 2.54520 |
| 250 +: | $ 2.38614 |
| 500 +: | $ 2.30659 |
| 1000 +: | $ 2.06798 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a vital element of any electronic equipment application. Heat needs to be efficiently dissipated away from the component to prevent damage and ensure user safety. The ATS-FPX035035030-89-C2-R0 is a versatile and efficient thermal management solution that increases the performance of various system components.
The ATS-FPX035035030-89-C2-R0 is a thermal heat sink designed for applications requiring high levels of reliable thermal conduction from PCB components. The sink is constructed from a lightweight aluminum alloy, which is highly effective at dispersing heat. The sink is designed in an efficient finned shape, which increases the surface area, allowing more heat to be dissipated. The aluminum alloy material ensures that the sink also has a very low thermal resistance, meaning that heat is conduct away from the component with minimal resistance.
This makes the ATS-FPX035035030-89-C2-R0 an ideal heat sink for applications requiring efficient and reliable thermal conduction from components on the PCB. The sink is capable of cooling most components with ease, including CPUs, GPUs, DRAMs, FPGAs, and power electronics. It can also be used to cool other systems such as telecommunications and server systems, as it can dissipate heat from multiple components at once.
The ATS-FPX035035030-89-C2-R0 features a robust design, which allows it to endure extreme temperatures and environmental conditions without compromising its performance. The heat sink also comes with stainless steel mounting clips, which makes installation and removal of the sink from the PCB an easy task.
The thermal performance of the ATS-FPX035035030-89-C2-R0 is further enhanced by its two-stage thermal protection system. This system consists of a thermal cutoff circuit and a soft start circuit which protect the heat sink from extreme temperatures. The thermal cutoff circuit will shut off the power to the sink if it becomes too hot, while the soft start circuit helps to limit the inrush current when powering the sink, helping to reduce the peak temperature of the sink.
The ATS-FPX035035030-89-C2-R0’s performance and reliability make it the perfect thermal management solution for any application, ensuring efficient and safe operation of all electronic components. The lightweight design and easy installation make it an ideal choice for anyone looking for a reliable and efficient way to manage the heat generated by their system.
The specific data is subject to PDF, and the above content is for reference