| Allicdata Part #: | ATS1730-ND |
| Manufacturer Part#: |
ATS-H1-07-C2-R0 |
| Price: | $ 6.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-07-C2-R0 Datasheet/PDF |
| Quantity: | 99 |
| 1 +: | $ 5.50620 |
| 10 +: | $ 5.36004 |
| 25 +: | $ 5.06243 |
| 50 +: | $ 4.76456 |
| 100 +: | $ 4.46683 |
| 250 +: | $ 4.16904 |
| 500 +: | $ 3.87125 |
| 1000 +: | $ 3.79680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important component of any computing system. It keeps the system running at an optimal temperature while protecting it from damage and performance degradation. Heat sinks are one of the most effective and common types of thermal management tools. ATS-H1-07-C2-R0 is a type of heat sink that is widely used in different application fields and its working principle is often used to provide an effective cooling solution.
The ATS-H1-07-C2-R0 is a versatile and lightweight heat sink, ideal for high-performance applications such as computer, HVAC, and lighting systems. It is composed of an aluminum fin array with a greater fin density and area than other heat sinks, which provides a greater heat transfer surface area to increase the total cooling capacity. It has a low thermal resistance of 0.2–0.4 °C/W and a wide operating temperature range of -40°C to 109°C. Its other features include an optimized profile with closer fins, an easy-cleaning interface, and excellent temperature dissipation.
The ATS-H1-07-C2-R0 heat sink is widely used in different types of electronic devices, including CPUs, GPUs, industrial motor drives, LED lighting, and automotive systems. It is also used in compact and mobile systems, such as laptops, tablets, and smartphones. The heat sink can be used in a variety of different operating conditions, from constant temperatures to environments with wide temperature fluctuations. Due to its lightweight construction, the ATS-H1-07-C2-R0 is well-suited for applications requiring small or slim design requirements.
The working principle of the ATS-H1-07-C2-R0 is based on the transfer of heat from a hot component to a cooler one. As the heat passes from the hot component to the heat sink, the fins of the heat sink increase the surface area of the heat sink, allowing for more efficient and effective heat transfer. The increased surface area helps to dissipate the heat faster, allowing the system to maintain optimal temperatures. Additionally, the fin density of the heat sink helps to increase its thermal performance, providing a greater cooling capacity.
The ATS-H1-07-C2-R0 is a reliable and effective thermal management tool that is ideal for a variety of applications. It can be used in conjunction with other thermal management components, such as air flow management and active cooling systems, to ensure optimal system performance. With its robust construction, efficient heat transfer properties, and range of features, the ATS-H1-07-C2-R0 is an ideal choice for systems that require reliable and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference