ATS-H1-10-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks ATS-H1-10-C3-R0 is a heat sink that is widely used in a variety of applications, ranging from computer hardware such as CPUs, GPUs, and RAM, to consumer electronics such as ACs and TVs. The heat sink is designed to draw heat away from the device and dissipate it into the air.The ATS-H1-10-C3-R0 heat sink consists of a base plate, which attaches to the component, and several cooling fins arranged in a specific pattern. The fins are designed to maximize the amount of heat dissipated. This is achieved by creating a large surface area that allows more air to flow over it. Additionally, the fins are spaced in such a way as to allow air to circulate more efficiently, providing a higher rate of heat dissipation.The ATS-H1-10-C3-R0 heat sink uses a fan to improve heat dissipation, by increasing the air flow over the fins. This fan can be mounted either on the top or side of the heat sink, depending on the application. The fan is usually connected to a power source, such as a motherboard or another device. In some cases, the fan may even be connected directly to the cooling fins for more effective cooling.The ATS-H1-10-C3-R0 is designed to work in conjunction with a thermal paste. This thermal paste is applied to the surface of the base plate, between the heat sink and the component. The thermal paste acts as a thermal bridge, allowing the heat to transfer more easily from the component to the heat sink. This helps the heat sink to be more efficient and effective at dissipating heat from the component.The ATS-H1-10-C3-R0 heat sink is suitable for a variety of applications, including computers, consumer electronics, and industrial components. The heat sink is designed to provide a reliable and efficient way of dissipating heat away from the component. It is easy to install and maintain, and its design ensures that it is suitable for a wide range of applications.In conclusion, the ATS-H1-10-C3-R0 heat sink is a reliable and effective way of dissipating heat from components. Its efficiency and design make it suitable for a variety of applications, including computers, consumer electronics, and industrial components. It is easy to install and maintain, and it is designed to provide a reliable and effective way of dissipating heat away from the component.

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