| Allicdata Part #: | ATS36300-ND |
| Manufacturer Part#: |
ATS-H1-100-C2-R0 |
| Price: | $ 7.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-100-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.55200 |
| 10 +: | $ 6.37308 |
| 25 +: | $ 6.01927 |
| 50 +: | $ 5.66521 |
| 100 +: | $ 5.31109 |
| 250 +: | $ 4.95702 |
| 500 +: | $ 4.60294 |
| 1000 +: | $ 4.51443 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks play an important role in many applications, ranging from small personal electronics to large industrial heaters. The ATS-H1-100-C2-R0 is a heat sink designed for specific applications in which superior cooling performance is necessary. In this article, we will take a look at the application field and working principle of the ATS-H1-100-C2-R0.
The ATS-H1-100-C2-R0 is a high-performance heat sink designed for use in medium- to high-power applications. It is suitable for operation at temperatures up to 100 °C. The heat sink features a large, aluminum alloy base plate that provides excellent structural and thermal stability. This allows it to efficiently dissipate heat from the power device. The heat sink also features a series of fins which maximize the surface area exposed to air, allowing for better heat conduction.
The ATS-H1-100-C2-R0 is designed for use in applications such as power supplies, LED lighting, automotive electronics, and more. It can also be used in applications where space is limited, such as compact medical devices or data centers. In addition to its superior cooling performance, the heat sink is low maintenance and does not require active airflow or fan cooling.
The ATS-H1-100-C2-R0 features two different types of heat dissipation; natural and forced convection. Natural convection heat dissipation is when air movement is caused by differences in temperature. This form of heat dissipation relies on air movement to carry away the heat. Forced convection heat dissipation is when an external force, such as a fan or blower, is used to actively push air through the heat sink, increasing the heat dissipation rate.
The ATS-H1-100-C2-R0 has a thermal resistance of 0.2 °C/W, meaning it is able to dissipate heat quickly and efficiently. It is also designed to be dry and dust-proof, meaning that the heat sink can remain functional in environments with a high amount of dust. This ensures that the heat sink does not need to be cleaned regularly and can be used in various environments.
In conclusion, the ATS-H1-100-C2-R0 is a high-performance heat sink designed for medium- to high-power applications. It features a large aluminum alloy base plate for structural and thermal stability, and a series of fins for maximum heat conduction. The heat sink also features both natural and forced convection heat dissipation, and has a thermal resistance of 0.2 °C/W. It is also designed to be dry and dust-proof to allow it to be used in various environments.
The specific data is subject to PDF, and the above content is for reference