ATS-H1-108-C2-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	27.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-H1-108-C2-R1 heat sink is designed to provide reliable and efficient cooling solutions for a variety of industrial applications. It is an active thermal solution of heat dissipation. It consists of a combination of metal fins and a fan mounted in a metal housing. This article will explore the application fields and working principles of the ATS-H1-108-C2-R1 heat sink.

Application Fields

The ATS-H1-108-C2-R1 heat sink is widely used in a variety of industrial applications. It is most commonly used to cool industrial electronic components, including microprocessors, amplifiers, transistors, and other components. It can also be used in other applications such as cooling large motors and extruders in automated manufacturing processes. In addition to its widespread industrial usage, the ATS-H1-108-C2-R1 heat sink is also popular in medical and telecommunications industries. It can be used to regulate the temperature in medical lasers and other devices, as well as to reduce heat build-up in telephone switches and routers. In addition, the ATS-H1-108-C2-R1 heat sink can also be used in military and aerospace applications. It is typically used in radar and missile guidance systems, as well as in aircraft engines and other military on-board systems.

Working Principle

The ATS-H1-108-C2-R1 heat sink utilizes a combination of metal fins and a fan mounted in a metal housing. The fins allow the air to flow freely and dissipate heat generated by the industrial components, such as microprocessors and amplifiers. The fan helps to draw the warm air away from the heat sink, allowing the air to cool quickly.The metal fins of the ATS-H1-108-C2-R1 heat sink are made of a special material that has high thermal conductivity. This material helps to absorb the heat generated from the components, which helps to keep them cool. In addition, the metal housing of the fan helps to further protect the components from the heat generated by the fan.

Conclusion

The ATS-H1-108-C2-R1 heat sink is an efficient and reliable active thermal solution of heat dissipation that is widely used in various industrial, medical, telecommunications, military, and aerospace applications. It utilizes a combination of metal fins and a fan mounted in a metal housing to quickly dissipate the heat generated by electronic components, allowing them to stay cool and work efficiently.

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