
Allicdata Part #: | ATS-H1-111-C3-R1-ND |
Manufacturer Part#: |
ATS-H1-111-C3-R1 |
Price: | $ 8.05 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 60X40X9.5MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 7.24248 |
30 +: | $ 6.81660 |
50 +: | $ 6.39072 |
100 +: | $ 5.96459 |
250 +: | $ 5.53858 |
500 +: | $ 5.43206 |
1000 +: | $ 5.32554 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.362" (60.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.374" (9.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 26.82°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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ATS-H1-111-C3-R1 Thermal - Heat Sinks Application Field and Working Principle
ATS-H1-111-C3-R1 Thermal - Heat Sinks are applied in a wide range of fields that demand efficient and reliable thermal management technology. With features such as a low profile, low noise, and a faster response time, Heat Sinks are suitable for applications in gaming, desktop computers, home theater systems, robots, and digital signage. They are also used in high performance computing systems in order to maintain optimal temperatures.
Application Fields:
- Gaming
- Desktop Computers
- Home Theater Systems
- Robots
- Digital Signage
- High Performance Computing
Working Principle of a Heat Sink:
Heat Sinks work by transferring heat away from the source. Heat from the source is transferred to the surface of the heat sink, where it dissipates into the surrounding environment. This is done through convection, with air flowing over the fins on the surface of the Heat Sink. The heat sink has an aluminum core, which is fitted with a copper bottom layer and fins. The fins are responsible for dissipating heat, and the copper layer ensures that the heat is quickly and effectively absorbed. The core absorbs and stores heat from the environment, which is then transferred to the heat sink\'s surface.
Heat Sinks work by conducting heat away from high-performance components. They are designed to be air- or liquid-cooled, depending on the application. When air-cooled, the air is pulled across the finned sides of the heat sink and up through the core. This process causes the air to become hotter, which helps to dissipate the heat away from the source. The heat is then released into the environment, resulting in a cooler operating temperature.
In the case of liquid-cooling, a fan pulls air over the surface of the heat sink, cooling it off. The cooled liquid then flows through the fins on the heat sink, where it absorbs more heat. It then returns to the radiator and dissipates the heat into the environment. This process is used in sensitive applications, such as Computer Aided Design (CAD) systems, high-end gaming rigs, industrial production lines, and robotics.
Conclusion:
ATS-H1-111-C3-R1 Thermal - Heat Sinks provide effective and reliable thermal management for a range of applications. With features such as a low profile, low noise, and faster response time, they are perfect for gaming, desktop computing, and home theater systems. They can also be used in high performance computing systems and robotics in order to maintain optimal temperatures. Heat Sinks work by conducting heat away from the source, through convection and either air or liquid cooling.
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