| Allicdata Part #: | ATS-H1-125-C1-R0-ND |
| Manufacturer Part#: |
ATS-H1-125-C1-R0 |
| Price: | $ 5.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-125-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.92723 |
| 30 +: | $ 4.65381 |
| 50 +: | $ 4.38001 |
| 100 +: | $ 4.10621 |
| 250 +: | $ 3.83246 |
| 500 +: | $ 3.55872 |
| 1000 +: | $ 3.49028 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-H1-125-C1-R0 is a type of Thermal-Heat Sink, a device that serves to passively wick the heat away from components such as microprocessors, semiconductors, LEDs, transistors, and other semiconductor devices. Thermal-heat sinks are often used in conjunction with active cooling systems such as cooling fans, thus providing the necessary cooling for these components. In the case of the ATS-H1-125-C1-R0, the passive, thermal-heat-sink aspect works to keep the temperature of the components down to a temperature that is within the specified limits, ready for operation.
The ATS-H1-125-C1-R0 has dimensions of 125x14x11mm, and has fins which provide for thermal heat dissipation. It is made of polished aluminum and is built to withstand high temperatures. The construction is light, durable, and corrosion resistant, and the fins are designed to effectively absorb and dissipate heat. It is also designed with ventilation to ensure proper airflow, further enhancing the overall performance of the device.
The ATS-H1-125-C1-R0\'s working principle is based on the fact that heat rises. Heat generated by the components is absorbed by the heat sink and then dissipated through the air surrounding it. The aluminum fins also act as a convection medium, allowing hot air to escape while passing colder air around the components to cool them. As the air is cooled due to the exhaust of the hot air, the cooler air then passes around the components to continue to cool them, keeping the components within the specified operational temperatures.
The ATS-H1-125-C1-R0 is well suited for applications in which thermal control is of utmost importance. High power transistors, processors, LEDs, and other electronic components which generate a lot of heat can be cooled efficiently by the ATS-H1-125-C1-R0 Thermal-Heat Sink. As mentioned previously, fans can be used for active cooling, but in many cases, the ATS-H1-125-C1-R0 is enough to keep the components at their optimal temperature.
The ATS-H1-125-C1-R0 Thermal-Heat Sink is a simple and efficient way of keeping components from overheating. The ATS-H1-125-C1-R0 is lightweight, durable, and rust resistant, and is easy to install and assemble. It requires little to no maintenance and is compatible with most motherboard designs. This makes it a great choice for those looking to provide cooling solutions to their components.
The specific data is subject to PDF, and the above content is for reference