| Allicdata Part #: | ATS-H1-127-C1-R0-ND |
| Manufacturer Part#: |
ATS-H1-127-C1-R0 |
| Price: | $ 5.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-127-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.19372 |
| 30 +: | $ 4.90497 |
| 50 +: | $ 4.61639 |
| 100 +: | $ 4.32791 |
| 250 +: | $ 4.03938 |
| 500 +: | $ 3.75086 |
| 1000 +: | $ 3.67873 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of electronic device operation, and different parts require different approaches to keep their temperatures well regulated. Heat sinks are one of the ways to dissipate heat and allow for better thermal performance. ATS-H1-127-C1-R0 is a copper heat sink designed for improved thermal dissipation.
The heat sink operates by conduction, transferring heat away from the electronic component and into the ambient air. To maximize this efficiency, air is forced over the heat sink using a fan or blower. This effectively increases the rate of heat dissipation by increasing the heat transfer coefficient of the heat sink.
ATS-H1-127-C1-R0 heat sinks provide the perfect balance between cooling efficiency and compact size. They are typically made of copper, a metal that has excellent thermal properties. It has high thermal conductivity, which allows it to dissipate heat quickly. It also has high thermal diffusivity, meaning that it will not become hot-spots or cause local heat buildup.
The heat sinks use fins to increase their surface area, allowing for more efficient heat dissipation. The fins are arranged in an optimized pattern which helps increase the heat transfer coefficient further. This helps to keep the electronic components cool efficiently.
ATS-H1-127-C1-R0 heat sinks have a wide application relevant to various thermal management solutions. They can be used in various electronic assemblies, such as cell phones, circuit boards, computers, TV sets as well as in heat exchangers. The heat sink provides an efficient cooling solution while remaining compact.
The heat sinks are also designed for easy installation and assembly. The mounting holes make it easy to install the heat sinks onto an interface without the need for soldering or additional tools. This makes them an attractive option for applications where space is at a premium or where minimal effort is required for assembly.
In summary, the ATS-H1-127-C1-R0 is a high-performance heat sink for cooling a wide range of electronic components. It allows for efficient cooling of an electronic assembly while remaining small and easy to install. The fins are arranged in an optimal pattern to maximize heat transfer while avoiding hot-spots. This makes it a great choice for a wide variety of thermal management solutions.
The specific data is subject to PDF, and the above content is for reference