| Allicdata Part #: | ATS36323-ND |
| Manufacturer Part#: |
ATS-H1-133-C2-R0 |
| Price: | $ 8.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-133-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 7.99470 |
| 10 +: | $ 7.54866 |
| 25 +: | $ 7.10465 |
| 50 +: | $ 6.66061 |
| 100 +: | $ 6.21652 |
| 250 +: | $ 5.77249 |
| 500 +: | $ 5.66147 |
| 1000 +: | $ 5.55046 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are advanced heat sink components used to remove and dissipate heat generated in specific applications. The ATS-H1-133-C2-R0 is one of the most popular products on the market today.
The ATS-H1-133-C2-R0 heat sink is a return-heat sink, made from aluminum and copper alloy material. It is designed to use a nominal 1.3 inch diameter bobbin with an overall depth of 0.5 inches, making it a suitable fit for many applications.
The ATS-H1-133-C2-R0 can be used in virtually any application that requires a thermal management solution. It is commonly used in industrial applications such as manufacturing, laboratory and medical equipment and automotive systems. The ATS-H1-133-C2-R0 is conveniently sized and configured for a wide range of electronics, vehicle, and communication applications.
Moreover, the ATS-H1-133-C2-R0 is also ideal for telecommunication, semiconductor and LED lighting equipment. Because of its efficient cooling performance, the ATS-H1-133-C2-R0 is capable of dissipating heat from high- powered components up to 150 watts.
The ATS-H1-133-C2-R0 utilizes a patented vertical fins design combined with an aerodynamic flow technique. This design provides an extremely large surface area for maximum heat dissipation. The bobbin works to increase the thermal transfer efficiency by diffusing the heat evenly to the aluminum fins. The aluminum fins then dissipate the heat away from the system components.
The ATS-H1-133-C2-R0 also features a unique dual-side design, which allows it to be mounted in either an upright or inverted position, depending on space and installation needs. The dual-side design also facilitates easy installation in tight corners where other heat sinks may not fit.
Another great feature of the ATS-H1-133-C2-R0 is its low-profile design, which reduces the amount of noise emitted in the environment. The low-profile design also allows a smaller footprint and makes it easier to install the component in environments with limited space.
The ATS-H1-133-C2-R0 is also UL, NSF and CE certified, making it a reliable and safe heat dissipation solution. In addition, the product is also RoHS and WEEE compliant, meaning that it is safe for use in the environment and does not emit hazardous materials.
Overall, the ATS-H1-133-C2-R0 is an advanced thermal-heat sink solution that is suitable for many applications. Its low-profile design, efficient style, and reliable performance make it an ideal choice for any application requiring thermal management.
The specific data is subject to PDF, and the above content is for reference