ATS-H1-166-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-H1-166-C3-R0 is a thermal - heat sink, which is specially designed for advanced thermal management. It is made up of a high-quality aluminum, featuring a carbon/glass fiber construction with a special coating that is effective at dissipating heat away from vital components. It is a great choice for applications which require reliable and efficient cooling.

Application Field

The ATS-H1-166-C3-R0 thermal - heat sink has many uses, including thermal management of electronic components. It can be used to help dissipate heat generated by computer and server components, such as processors, RAM, graphics cards, and more. It can also be used in other applications such as automotive electronics and other industrial applications. The ATS-H1-166-C3-R0 thermal - heat sink is an ideal choice for these types of applications, due to its superior cooling abilities.Another application field for this thermal - heat sink is in the area of high-power LEDs. It can be used to help reduce the heat generated by these powerful LEDs, while also providing reliable and efficient cooling. The ATS-H1-166-C3-R0 can be used to help improve the performance of these high-power LED lights, as it is able to dissipate heat effectively and efficiently.Finally, the ATS-H1-166-C3-R0 thermal - heat sink can be used for a variety of other applications, such as medical devices, communications systems, and high-speed electronic systems. In all of these applications, the ATS-H1-166-C3-R0 provides the same outstanding performance and reliability that it does for thermal management in computer and server components.

Working Principle

The ATS-H1-166-C3-R0 thermal - heat sink works on multiple layers. The upper layer is made of a high-quality aluminum with a special coating that is effective at dissipating heat away from vital components. The middle layer is made of a carbon/glass fiber construction that is designed to absorb and transfer heat away from the source component and disperse it evenly. Lastly, a thin layer of plastic is applied to the heat sink to ensure the highest level of efficiency.The heat sink’s design is such that it can effectively and efficiently absorb and transfer heat away from the source component, allowing for better thermal performance. It is able to absorb and dissipate large volumes of heat, while at the same time being highly efficient.Once the heat generated by the source component passes through the ATS-H1-166-C3-R0 thermal - heat sink, it is then dissipated away from the source and dispersed. The heat is spread across multiple surfaces of the heat sink, ensuring that no single point receives more heat than the others. This allows for better cooling efficiency and improved performance.

Conclusion

Overall, the ATS-H1-166-C3-R0 thermal - heat sink is an excellent choice for applications which require reliable and efficient cooling. It is able to dissipate large volumes of heat with minimal power consumption, while also providing superior cooling performance. The ATS-H1-166-C3-R0 can be used for a variety of applications, including thermal management of electronic components, automotive electronics, high-power LEDs, and more. As such, it is an ideal choice for those looking for optimal cooling performance.

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