ATS-H1-170-C1-R0

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Heat sinks are a critical component in modern electronic systems and, as such, their application in a variety of fields continues to increase. In particular, the ATS-H1-170-C1-R0 heat sink from Advanced Thermal Solutions is a popular choice for applications that require efficient thermal management. To understand the properties and application of the ATS-H1-170-C1-R0, it is important to consider its design and working principle.

The ATS-H1-170-C1-R0 heat sink is an extruded aluminum design measuring 4.92” tall, 2.6” wide and 5.9” deep. It features a thermally conductive copper core and includes multiple outer ribs designed to improve thermal distribution within the heat sink and help enhance heat dissipation. The core of the heat sink also includes a thermally conductive metallic spreader, which acts as a bridge between the cold plate and the fins of the heat sink. This spreader helps remove the heat from the cold plate and transfer it to the fins, where it is dissipated into the surrounding air.

In addition to its design, the working principle of the ATS-H1-170-C1-R0 heat sink is based on the principle of thermal interface materials. The material used for the heat sink contains a thermally conductive layer which helps transfer heat from the device to the fins of the heat sink. This thermal interface layer also helps ensure that heat is evenly distributed and not concentrated in one area. This enables the heat sink to effectively dissipate heat and maintain the temperature of the device.

The ATS-H1-170-C1-R0 heat sink is suitable for a wide range of applications including industrial, consumer electronics, automotive, medical, and more. It is an efficient cooling solution for high-powered devices due to its thermal efficiency and low profile size. The ATS-H1-170-C1-R0 heat sink is also commonly used in computers, servers, and other electronics that require efficient thermal management. It can also be used as a replacement for standard fans in some cases.

The efficiency of the ATS-H1-170-C1-R0 heat sink is further increased by the combination of thermal adhesive and thermally conductive compound. The thermal adhesive helps form a strong bond between the cold plate and the heat sink, providing a secure and efficient thermal transfer path. The thermally conductive compound helps reduce thermal losses, allowing the heat sink to remain cooler even under heavy loads.

Overall, the ATS-H1-170-C1-R0 heat sink from Advanced Thermal Solutions is an efficient and reliable thermal management solution. Its reliable design, efficient working principle, and effective thermal management make it suitable for a variety of applications. In addition, its flexibility and low profile mean that it is compatible with a wide range of devices and environments. As such, the ATS-H1-170-C1-R0 heat sink can help provide reliable thermal management for a number of different applications.

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