| Allicdata Part #: | ATS-H1-178-C1-R0-ND |
| Manufacturer Part#: |
ATS-H1-178-C1-R0 |
| Price: | $ 5.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-178-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.19372 |
| 30 +: | $ 4.90497 |
| 50 +: | $ 4.61639 |
| 100 +: | $ 4.32791 |
| 250 +: | $ 4.03938 |
| 500 +: | $ 3.75086 |
| 1000 +: | $ 3.67873 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-H1-178-C1-R0 is a heat sink specifically designed for high-performance cooling applications. It features a high thermal resistance, low noise operation and high thermal conductivity. It is typically used in applications where excellent thermal performance is required, such as non-critical electronic components, high-power amplifiers, and other thermal management materials.
The design of ATS-H1-178-C1-R0 includes a hot plate surface that is machined to a 0.019 mm radius. It has two central recesses with an outer ring surrounding the plate. The recesses can be used to accommodate larger components as well as to provide ventilation outlets. The overall size of the heat sink measures 178 mm in length and 50 mm in width. The height is 37 mm. The heat sink utilizes a thin-film technology that allows it to absorb heat quickly from the component being cooled.
The thermal resistance of the ATS-H1-178-C1-R0 is specified as 4.18 K/W maximum and it can dissipate up to 40 watts of heat. This thermal resistance ensures that it can be used in applications that require high power components such as power amplifiers and microwave ovens. Additionally, the heat sink has a high thermal conductivity which ensures that heat is quickly transferred away from the component being cooled. In addition, its thin film technology allows the heat sink to operate without fan or other cooling solutions.
The ATS-H1-178-C1-R0 also features a low noise operation. This allows it to work more effectively in applications that require minimal noise. Additionally, its design incorporates an aluminum core that not only aids in heat transfer but also provides additional rigidity and durability. This allows the heat sink to withstand shocks and vibrations that come from rigorous use.
Overall, the ATS-H1-178-C1-R0 is an excellent choice for cooling high-performance components and systems that operate in high-temperature and high-performance environments. Its high thermal resistance, low noise operation and high thermal conductivity make it an ideal choice for cooling applications that require reliable performance and minimal noise.
The specific data is subject to PDF, and the above content is for reference