| Allicdata Part #: | ATS-H1-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-H1-185-C3-R0 |
| Price: | $ 6.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.86467 |
| 30 +: | $ 5.53854 |
| 50 +: | $ 5.21275 |
| 100 +: | $ 4.88697 |
| 250 +: | $ 4.56117 |
| 500 +: | $ 4.23538 |
| 1000 +: | $ 4.15393 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Application Field and Working Principle of ATS-H1-185-C3-R0
ATS-H1-185-C3-R0 is a thermal heat sink, specifically designed to dissipate heat in various electronic components and devices to ensure optimal performance. With its effective design and multipurpose use, this type of heat sink is suitable for a wide range of applications, from basic desktop computer systems to data centers that contain thousands of computers.
Applications of ATS-H1-185-C3-R0 Thermal Heat Sinks:
The applications of ATS-H1-185-C3-R0 thermal heat sinks span multiple industries. These heat sinks are used in desktop PCs, servers, distributed systems, embedded systems and embedded processors, as well as military applications. In addition, they are successful in providing heat dissipation for a variety of electronic components, such as CPUs, GPUs, voltage regulators, and memory modules. The heat sink’s aluminum fins provide a large surface area without taking up a lot of space, resulting in efficient heat transfer.
Working Principle of ATS-H1-185-C3-R0 Thermal Heat Sinks:
The working principle of ATS-H1-185-C3-R0 thermal heat sinks is quite simple. When the device they are attached to produces heat, the heat is transferred to the heat sink, which increases the temperature of the sink itself. This causes the air molecules surrounding the heat sink to move more quickly, creating a convection current that rapidly dissipates the heat into the surrounding atmosphere. In addition, due to its aluminum fins, this heat is transferred to a larger surface area than would otherwise be possible, resulting in faster and more effective heat dissipation.
Conclusion:
By dissipating heat away from electronic components and devices, ATS-H1-185-C3-R0 thermal heat sinks enable efficient and reliable performance. This type of heat sink is suitable for a wide range of applications, from basic desktop computers to military installations, due to its effective design and multipurpose use. The working principle of these heat sinks is quite simple and based on convectional heat transfer, with the heat being dissipated quickly and effectively due to its aluminum fins.
The specific data is subject to PDF, and the above content is for reference