| Allicdata Part #: | ATS-H1-187-C1-R0-ND |
| Manufacturer Part#: |
ATS-H1-187-C1-R0 |
| Price: | $ 5.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-187-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.12379 |
| 30 +: | $ 4.83945 |
| 50 +: | $ 4.55477 |
| 100 +: | $ 4.27008 |
| 250 +: | $ 3.98541 |
| 500 +: | $ 3.70073 |
| 1000 +: | $ 3.62957 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become a major concern in the electronics industry with modern components becoming more and more powerful and miniature in size. Heat generated by components must be removed or dissipated for optimal operating efficiency. Heat sinks are used to absorb the heat generated by components and not allow it to accumulate and damage the components. The ATS-H1-187-C1-R0 is a high quality, low profile, heat sink that offers the best performance and reliability.
ATS-H1-187-C1-R0 Application Field
The ATS-H1-187-C1-R0 has been designed to be used in many types of electronic equipment such as computer motherboards, telecom equipment, power supplies, and industrial control systems. It can also be used with embedded processors, controller cards, and memory chips. The ATS-H1-187-C1-R0 can be used in both commercial and industrial applications. It offers superior thermal management benefits in comparison to other heat sinks due to its low profile design.
ATS-H1-187-C1-R0 Working Principle
The ATS-H1-187-C1-R0 utilizes the air flow generated by the computer components to transfer the heat generated by the components. This works by drawing the air flow to the heat sink, forcing it to directly contact the components as it passes over them. The heat generated by the components is then absorbed by the fins of the heat sink. The fins of the heat sink are also designed to increase the surface area of the heat sink, which increases the amount of heat absorbed. This increased surface area also means that a larger area is exposed to the air flow, meaning more heat is dissipated.
The fins of the ATS-H1-187-C1-R0 are also designed to optimize the air flow. The fins are designed with an asymmetrical pattern that directs the air flow in two directions, both above and below the fins. This helps to disperse the air flow evenly around the component, allowing the heat generated by the component to be dissipated more efficiently. This results in better thermal management and an overall improvement in the performance of the component.
The ATS-H1-187-C1-R0 is also designed to be as efficient as possible. It uses a patented heat-pipe technology that allows the heat sink to operate at a much lower temperature than other traditional heat sinks. This allows the heat sink to operate more efficiently, meaning that less energy is required to keep the components cool. This ensures that the components remain within their specified temperature range and allows for optimal performance.
In conclusion, the ATS-H1-187-C1-R0 is an ideal choice for thermal management solutions. It is a high quality, low profile, heat sink that offers superior thermal management benefits. Its asymmetrical fins allow for an efficient air flow, while the patented heat-pipe technology helps to reduce the temperature of the heat sink, ensuring optimal performance and reliability. It is suitable for use in commercial and industrial applications, making it a versatile and reliable choice for thermal management needs.
The specific data is subject to PDF, and the above content is for reference