ATS-H1-198-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksHeat sinks are devices made of a metal, such as aluminum or copper, that absorb and dissipate heat generated by electronic components. They are often attached directly to the component they are cooling, or to an external heat exchanger.The design of a heat sink is important for achieving its intended purpose. A heat sink must provide a large surface area to dissipate heat, and must have an efficient fin design for increased heat transfer. The material used in the construction of the heat sink is also important; aluminum is lightweight, relatively inexpensive, and has excellent heat transfer capabilities, which make it an ideal choice for many applications. Copper is also a popular choice, as it can achieve a greater rate of heat transfer than aluminum, however it is more expensive to produce.H1-198-C3-R0 is a powerful thermal heat sink solution designed to provide optimal cooling performance. It is made of aluminum for its light weight, strength, cost effectiveness, and excellent thermal properties. The heat sink design consists of a hollow base and a finned top section. The heat sink features an extruded fin design with a variety of fin geometries to maximize heat transfer efficiency. The hollow base allows the heat sink to be mounted directly to the surface of the electronic component, and the finned top section allows heat to be transferred to the atmosphere quickly.In addition to its design, H1-198-C3-R0 also features high performance thermal materials and thermal interfaces to ensure maximum thermal transfer. The thermal materials are designed to provide a low thermal resistance between the heat sink and the component, and to ensure optimal heat transfer. The high performance thermal interfaces are designed to minimize air gaps between the heat sink and the component, resulting in improved thermal performance from the heat sink.H1-198-C3-R0 is designed for discrete power component cooling, and can be used in a wide range of applications. It is ideal for applications such as power converters, DC-DC converters, Logic ICs, MOSFETs, IGBTs, and high power LED modules. The versatile heat sink design enables it to be used for horizontal or vertical mounting, making it a great solution for applications requiring a high level of flexibility.In conclusion, H1-198-C3-R0 is a powerful thermal heat sink that is designed to provide optimal cooling performance. It utilizes high performance materials and thermal interfaces to ensure maximum thermal transfer, and its versatile design enables it to be used for both horizontal and vertical mounting. Its design and materials make it a great solution for a wide range of applications, from power converters to high power LED modules.

The specific data is subject to PDF, and the above content is for reference