| Allicdata Part #: | ATS-H1-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-H1-20-C3-R0 |
| Price: | $ 6.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.17652 |
| 30 +: | $ 5.83359 |
| 50 +: | $ 5.49032 |
| 100 +: | $ 5.14723 |
| 250 +: | $ 4.80408 |
| 500 +: | $ 4.46093 |
| 1000 +: | $ 4.37514 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been a top priority for consumer electronic products due to the stringent production and safety requirements in the market. Heat sinks are highly-efficient heat-dissipation components used in a variety of electronic applications.
The ATS-H1-20-C3-R0 is a high-efficiency, multi-stage heat sink with an advanced heat transfer mechanism. It is designed for use in a range of challenging thermal management applications. The ATS-H1-20-C3-R0 features a high-performance heat transfer design, utilizing a combination of copper fins and aluminum base to maximize thermal performance.
The ATS-H1-20-C3-R0 is capable of transferring heat effectively across a wide temperature range. Its advanced design ensures efficient heat transfer from the device to the copper fins so that the thermal shock can be minimized. Additionally, the ATS-H1-20-C3-R0 is designed to be maintenance free, allowing it to save costs over the life of the product.
The primary application field for the ATS-H1-20-C3-R0 is high-performance electronic products such as computers, mobile devices, set-top boxes and more. It is also suitable for use in industrial and medical applications. The heat sink is designed to ensure reliable operation and thermal stability regardless of the operating environment.
The working principle of the ATS-H1-20-C3-R0 relies on several different design features. The copper fins are designed to efficiently transfer heat away from the device components, while the aluminum base serves as a heat sink to dissipate the heat away from the component surface. Additionally, the high-performance design of the heat sink facilitates effective air convection, allowing air to circulate around the device and cool the component area.
The ATS-H1-20-C3-R0 is equipped with two mounting options, allowing it to be used in a variety of different applications. Its small size and lightweight construction make it ideal for applications requiring efficient thermal management and heat dissipation in confined spaces. Additionally, the flexible design allows the ATS-H1-20-C3-R0 to be adapted for use with a range of different mounting solutions.
The ATS-H1-20-C3-R0 is an advanced heat sink solution that is suitable for a variety of applications. Its high-efficiency design ensures reliable thermal performance and heat dissipation over a wide temperature range. Furthermore, its maintenance-free design makes it an ideal choice for a range of different electronic applications.
The specific data is subject to PDF, and the above content is for reference