| Allicdata Part #: | ATS-H1-203-C1-R0-ND |
| Manufacturer Part#: |
ATS-H1-203-C1-R0 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-H1-203-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.90455 |
| 30 +: | $ 4.63176 |
| 50 +: | $ 4.35935 |
| 100 +: | $ 4.08694 |
| 250 +: | $ 3.81448 |
| 500 +: | $ 3.54201 |
| 1000 +: | $ 3.47390 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important factor for industrial operations as the appropriate amount of heat generated from equipment is essential for its functioning and longevity. Heat sinks are used to dissipate unwanted heat away from sensitive electronic components operating at high temperatures, and the ATS-H1-203-C1-R0 is one type of heat sink designed to do just that. Thermal management is an important factor for industrial operations as the appropriate amount of heat generated from equipment is essential for its functioning and longevity.
The ATS-H1-203-C1-R0 is a single-piece heat sink featuring a thermal resistance of 0.073 K/W, and an active heat sink surface area of 195 square centimeters. This finned heat sink is designed to provide a highly efficient way to dissipate heat from various sources. This type of heat sink is typically used in electrical enclosures and cabinets, as well as other applications such as telecommunications, signal processing, and medical equipment.
The ATS-H1-203-C1-R0\'s design is based on a concept known as "heat pipe technology," which uses the principle of conduction to transfer heat away from its source. This is done by using tubes filled with a special working fluid that is thermally conductive. As the heat passes through the fluid, heat is then transferred to a desired area such as a heat sink. Due to thermal conduction, the heat is efficiently dissipated away from its source. Often, these types of heat sinks are used in combination with fans and other cooling devices in order to achieve maximum efficiency.
The ATS-H1-203-C1-R0 also features an optimized fin design with a non-rectangular air pattern that facilitates efficient heat dissipation and improved airflow. This innovative design creates advective cooling, whereby turbulent airflow patterns increase the surface area for heat dispersal. This also helps to minimize the amount of energy used, as less power is required in order to achieve the desired airflow.
The ATS-H1-203-C1-R0 also features a high-temperature operation, making it suitable for the most demanding applications. The heat sink also has a wide operating temperature range, as well as an efficient heat dissipation capability. This makes it ideal for applications that require steady temperatures and low-noise operation.
The ATS-H1-203-C1-R0 heat sink is one of the most versatile heat sinks available in the market, and is designed to meet the needs of various demanding applications. Its thermal resistance of 0.073 K/W, combined with its optimized fin design, make the ATS-H1-203-C1-R0 a perfect solution for high-temperature applications. In addition, its wide operating temperature range and efficient heat dissipation make it a great choice for energy-efficient cooling systems.
The specific data is subject to PDF, and the above content is for reference